© Semiconductor Components Industries, LLC, 2007
June, 2007 - Rev. 5
1 Publication Order Number:
NTD32N06L/D
NTD32N06L
Power MOSFET
32 Amps, 60 Volts
Logic Level, N-Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
•Smaller Package than MTB30N06VL
•Lower R
DS(on)
, V
DS(on)
, and Total Gate Charge
•Lower and Tighter V
SD
•Lower Diode Reverse Recovery Time
•Lower Reverse Recovery Stored Charge
•Pb-Free Packages are Available
Typical Applications
•Power Supplies
•Converters
•Power Motor Controls
•Bridge Circuits
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain-to-Source Voltage V
DSS
60 Vdc
Drain-to-Gate Voltage (R
GS
= 10 MW)
V
DGR
60 Vdc
Gate-to-Source Voltage - Continuous
- Non-Repetitive (t
p
v10 ms)
V
GS
V
GS
"20
"30
Vdc
Drain Current - Continuous @ T
A
= 25°C
- Continuous @ T
A
= 100°C
- Single Pulse (t
p
v10 ms)
I
D
I
D
I
DM
32
22
90
Adc
Apk
Total Power Dissipation @ T
A
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 25°C (Note 1)
Total Power Dissipation @ T
A
= 25°C (Note 2)
P
D
93.75
0.625
2.88
1.5
W
W/°C
W
W
Operating and Storage Temperature Range T
J
, T
stg
-55 to
+175
°C
Single Pulse Drain-to-Source Avalanche
Energy - Starting T
J
= 25°C (Note 3)
(V
DD
= 50 Vdc, V
GS
= 5 Vdc, L = 1.0 mH,
I
L(pk)
= 25 A, V
DS
= 60 Vdc, R
G
= 25 W)
E
AS
313 mJ
Thermal Resistance
- Junction-to-Case
- Junction-to-Ambient (Note 1)
- Junction-to-Ambient (Note 2)
R
q
JC
R
q
JA
R
q
JA
1.6
52
100
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to FR4 board using 0.5 in pad size.
2. When surface mounted to FR4 board using minimum recommended pad size.
3. Repetitive rating; pulse width limited by maximum junction temperature.
http://onsemi.com
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Y = Year
WW = Work Week
32N06L = Device Code
G = Pb-Free Package
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369C
(Surface Mount)
STYLE 2
YWW
32N
N06LG
1
2
3
4
YWW
32N
N06LG
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369D
(Straight Lead)
STYLE 2
1
2
3
4
N-Channel
D
S
G
V
DSS
R
DS(ON)
TYP I
D
MAX
60 V
23.7 mW
32 A
