M25SI
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Vishay Draloric
Revision: 11-Nov-15
5
Document Number: 20031
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
IEC 60068-2-xx, test methods
The table presents only the most important tests, for the full
test schedule refer to the documents listed above. However,
some additional tests and a number of improvements
against those minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
Note
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
M25SI1206 5 Ω to 3.9 kΩ
4.5 - Resistance -± 5 % R
4.8 - Temperature coefficient
At (20 / -55 / 20) °C
and (20 / 125 / 20) °C
± 100 ppm/K
4.25.1 -
Endurance at 70 °C:
standard operation mode
U = ≤ U
max.
;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ≤ ± 1 % R
4.25.3 -
Endurance at upper category
temperature
125 °C; 1000 h ≤ ± 1 % R
4.24 78 (Cab) Damp heat, steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
≤ ± 0.5 % R
4.19 14 (Na) Rapid change of temperature
30 min at LCT;
30 min at UCT;
LCT = -55 °C; UCT = 125 °C
≤ ± 0.2 % R
4.18 58 (Td) Resistance to soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
≤ ± 0.2 % R
