DATA SHEET • SKY13575-639LF: DUAL-BAND MATCHED SP4T WIFI SWITCH
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 January 13, 2016 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 203270C
Table 4. Logic Truth Table
1
Low-Loss Path VC1 VC2
RFC to RF1 L L
RFC to RF2 L H
RFC to RF3 H L
RFC to RF4 H H
1
H = 2.5 to 3.3 V
L = 0 to 0.45 V
Evaluation Board Description
The SKY13575-639LF Evaluation Board is used to test the
performance of the SKY13575-639LF. An Evaluation Board
schematic diagram is provided in Figure 3. Figure 4 shows the
Evaluation Board assembly diagram.
Package Dimensions
The PCB layout footprint for the SKY13575-639LF is provided in
Figure 5. Typical part markings are shown in Figure 6. Package
dimensions are shown in Figure 7, and tape and reel dimensions
are provided in Figure 8.
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY13575-639LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
RF I/O Port 1 RF I/O Port 2
RF I/O Port 4 RF I/O Port 3
C4 C5
C2
C6
C1
C7
C1 = C2 = C3 = C4 = C5 = 22 pF
Battery
Voltage
Control
Control
C6 = 10 nF
C7 = 1 µF
C3
RF I/O
GND
GND
GND
GND
GND
GND
GND
RFC
RF1 RF2
RF4 RF3
VDD
VC2
VC1
1
2
3
4
11
10
9
8
5 6 7
14 13 12
203270C-003
Figure 3. SKY13575-639LF Evaluation Board Schematic
