Data Sheet HMC557A
Rev. C | Page 3 of 23
ELECTRICAL SPECIFICATIONS
2.5 GHz TO 5.0 GHz FREQUENCY RANGE
T
A
= 25°C, IF = 100 MHz, LO drive = 15 dBm. All measurements performed as a downconverter with the upper sideband selected, unless
otherwise noted.
Table 1.
Parameter Min Typ Max Unit
OPERATING CONDITIONS
RF Frequency Range 2.5 5.0 GHz
LO Frequency Range
2.5
5.0
GHz
IF Frequency Range DC 3 GHz
PERFORMANCE
Conversion Loss
8
10.5
dB
Noise Figure, Single Sideband (SSB) 8 dB
LO to RF Isolation 40 50 dB
LO to IF Isolation 26 35 dB
RF to IF Isolation 20 dB
Input Third-Order Intercept (IP3) 14 18 dBm
Input Second-Order Intercept (IP2) 55 dBm
Input Power for 1 dB Compression (P1dB) 10 dBm
RF Port Return Loss 10 dB
LO Port Return Loss 8 dB
5.0 GHz TO 7.0 GHz FREQUENCY RANGE
T
A
= 25°C, IF = 100 MHz, LO drive = 15 dBm. All measurements performed as a downconverter with the upper sideband selected, unless
otherwise noted.
Table 2.
Min
Typ
Max
Unit
OPERATING CONDITIONS
5.0
7.0
GHz
LO Frequency Range 5.0 7.0 GHz
IF Frequency Range DC 3 GHz
Conversion Loss 8.5 10.5 dB
Noise Figure, Single Sideband (SSB) 8.5 dB
LO to RF Isolation 37 43 dB
LO to IF Isolation 25 33 dB
RF to IF Isolation 25 dB
Input Third-Order Intercept (IP3) 14 18 dBm
Input Second-Order Intercept (IP2) 55 dBm
Input Power for 1 dB Compression (P1dB) 10 dBm
RF Port Return Loss 12 dB
LO Port Return Loss 12 dB
HMC557A Data Sheet
Rev. C | Page 4 of 23
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
RF Input Power 25 dBm
LO Input Power 27 dBm
Channel Temperature 175°C
Continuous P
DISS
(T = 85°C), Derate
10.81 mW/°C Above 85°C)
972 mW
Thermal Resistance (Channel to Ground Pad) 92.5°C/W
Maximum Peak Reflow Temperature 260°C
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range −40°C to +85°C
ESD Sensitivity, Human Body Model (HBM) 1000 V (Class 1C)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Data Sheet HMC557A
Rev. C | Page 5 of 23
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC
NIC
GND
LO
GND
NIC
1
2
3
4
5
6
18
17
16
15
14
13
NIC
HMC557A
T
OP
VIEW
(Not to Scale)
NOTES
1. NIC = NO INTERNAL CONNECTION.
2. CONNECT THE EXPOSED PAD TO A
LOW IMPEDANCE THERMAL AND
ELECTRICAL GROUND PLANE.
19
20
21
22
23
24
GND
RF
GND
NIC
NIC
NIC
NIC
NIC
NIC
NIC
NIC
NIC
NIC
GND
IF
GND
NIC
7
8
9
10
11
12
13161-102
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 5 to 7, 11 to
14, 18 to 24
NIC
No Internal Connection. No connection is required on these pins. These pins are not internally
connected. However, all data is measured with these pins connected to RF/dc ground externally.
2, 4, 8, 10, 15, 17 GND Ground Connect. Connect these pins and the package bottom to RF/dc ground.
3
LO
Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω.
9 IF
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc,
block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source or sink more than 2 mA of current or device
nonfunctionality or device failure may result.
16 RF Radio Frequency Port. This pin is dc-coupled and matched to 50 Ω.
EPAD
Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground plane.

HMC557ALC4

Mfr. #:
Manufacturer:
Analog Devices / Hittite
Description:
RF Mixer Double-Balanced
Lifecycle:
New from this manufacturer.
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