PMEG2010EH_EJ_ET_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 20 March 2007 7 of 11
NXP Semiconductors
PMEG2010EH/EJ/ET
1 A very low V
F
MEGA Schottky barrier rectifiers
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PMEG2010EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
PMEG2010EJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
PMEG2010ET SOT23 4 mm pitch, 8 mm tape and reel -215 -235
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 9. Reflow soldering footprint SOD323F (SC-90)
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste