PMEG2010EH_EJ_ET_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 20 March 2007 4 of 11
NXP Semiconductors
PMEG2010EH/EJ/ET
1 A very low V
F
MEGA Schottky barrier rectifiers
6. Thermal characteristics
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses P
R
are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[4] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: t
p
≤ 300 µs; δ≤0.02.
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
PMEG2010EH
[2]
- - 330 K/W
[3]
- - 150 K/W
PMEG2010EJ
[2]
- - 350 K/W
[3]
- - 150 K/W
PMEG2010ET
[2]
- - 440 K/W
[3]
- - 300 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
[4]
PMEG2010EH - - 60 K/W
PMEG2010EJ - - 55 K/W
PMEG2010ET - - 120 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V
F
forward voltage
[1]
I
F
= 0.1 mA - 90 130 mV
I
F
= 1 mA - 150 190 mV
I
F
= 10 mA - 210 240 mV
I
F
= 100 mA - 280 330 mV
I
F
= 500 mA - 355 390 mV
I
F
= 1000 mA - 420 500 mV
I
R
reverse current V
R
=10V - 15 40 µA
V
R
= 20 V - 40 200 µA
C
d
diode capacitance V
R
=1V;
f=1MHz
- 6680pF