LT4351
10
4351fd
In that case, the resistor values are set by:
R3 =
UV
HYST
I
UVHYST
R2 =
V
UV
UV
FAULT
OV
FAULT
V
OV
UV
FAULT
– V
UV
R3
R1=
V
OV
UV
FAULT
OV
FAULT
UV
FAULT
– V
UV
( )
R3
Hysteresis helps prevent erratic behavior due to the noise
on V
IN
. Two of the most common noise sources are: V
IN
dipping when the MOSFETs first turn on and draw down
the voltage on the V
IN
capacitors, and the boost regulator
switch turning on and drawing current from the V
IN
ca-
pacitors. Use low ESR capacitors for V
IN
and OUT filtering.
Note that because the UV pin uses current hysteresis,
placing a capacitor on UV to ground to filter noise will
reduce the effective hysteresis. Filtering can be achieved
by splitting the R2 resistor, as shown in Figure 4.
To defeat undervoltage fault detection, the UV pin should
be tied higher than 0.33V. UV can be tied to V
IN
provided
V
IN
< 9V. Overvoltage fault detection can be defeated by
grounding the OV pin. Do not exceed V
IN
.
APPLICATIONS INFORMATION
External Shutdown
To externally turn off the MOSFETs, such as to disable the
supply, use an open-collector transistor pulling down on
the UV pin. Note this will not turn off the boost regulator
which will continue to operate.
Boost Regulator
The boost regulator will start working as soon as V
IN
is
greater than 0.85V. The regulator will supply all the cur-
rent for the gate drive amplifier. While the amplifier itself
requires only about 3mA, larger current pulses are required
when charging the MOSFET gate. The reservoir capacitor
on V
DD
will provide this current (Figure 6).
The regulator performance is relatively insensitive to the
inductor value. The inductor value does control the fre-
quency of operation. A 4.7µH inductor is recommended
for V
IN
voltages less than 10V and 10µH for V
IN
voltages
greater than 10V. Several inductors that work well with
the LT4351 are listed in Table 1. Many different sizes and
shapes are available. Consult each manufacturer for more
detailed information and for their entire selection of related
parts. The switching frequency for the boost regulator is
around 1MHz so ferrite core inductors should be used
to obtain the best efficiency. The inductor must handle a
peak current of 0.7A minimum and have a DC resistance
of 0.5Ω or less. Shielded inductors are recommended to
reduce the noise due to inductive switching.
Table 1. Recommended Inductors
PART NUMBER IND (µH) DCR (mΩ) VENDOR
LPS3314-472ML
LPS4012-103ML
4.7
10
175
350
Coilcraft
847-639-6400
www.coilcraft.com
744029004
744042100
4.7
10
200
150
Würth Elektronik
www.we-online.com
SD3112-4R7-R
SD3118-100-R
4.7
10
246
295
Coiltronics
www.coiltronics.com
L1
D1
D2
QSW
GND
SW
V
DD
C
DD
4351 F06
V
IN
LT4351
Figure 5. Graphical Representation of the UV and OV Functions
OVERVOLTAGE FILTERED FAULT
INPUT
REFERRED
OV
REFERRED
UV
REFERRED
V
UV
= 0.33V
V
UV
= 0.3V
V
UV
< 0.3V
V
OV
> 0.3V
V
OV
= 0.3V
4351 F05
OV
FAULT
UV
FAULT
+ UV
HYST
UV
FAULT
UNDERVOLTAGE HYSTERESIS
OVERVOLTAGE FAULT:
GATE LOW
UNDERVOLTAGE FAULT:
GATE LOW
GATE CONTROLLED
BY V
IN
– V
OUT
Figure 6
LT4351
11
4351fd
For V
IN
less than 2V, choose a DC resistance less than 0.2Ω.
Note that V
DD
current referred to the input supply is higher.
A first order approximation of the input current is:
I
VINVDD
= 1+
10.6
V
IN
I
VDD
80%
Under normal operation, the V
DD
current is under 10mA
and the boost regulator operates in Burst Mode
®
operation.
If any additional load is added, ensure that the regulator is
capable of supplying that load. As the load is increased,
the boost regulator will switch into continuous mode op-
eration. Further increases in load will collapse the boost
regulator voltage.
Operating the regulator with increased load will cause
increased IC power dissipation and temperature, which
must be taken into consideration.
A 100ns delay from detecting the switch current limit to
turning off the power switch produces an overshoot of the
inductor current from the 0.45A switch limit. The amount
of overshoot depends on the boost regulator inductance.
Choosing an inductor that can handle 0.75A peak current
will be sufficient for the recommended inductors.
Diode Selection
Schottky diodes, with their low forward voltage drop and
fast switching speed, are the best match for the LT4351
boost regulator. Select a diode that can handle 0.75A peak
current and a reverse breakdown of 15V greater than the
maximum V
IN
.
APPLICATIONS INFORMATION
V
DD
Capacitor Selection
Low ESR (Equivalent Series Resistance) capacitors should
be used on V
DD
to minimize the output ripple voltage.
Multilayer ceramic capacitors are the best choice, as
they have a very low ESR and are available in very small
packages. Always use a capacitor with a voltage rating at
least 12V greater than V
IN
.
Capacitors
Two types of input capacitors are generally needed for the
LT4351. The first is a large bulk capacitor that takes care
of ringing associated with inductance of the input supply
lines and provides charge for the load when switching the
MOSFET. The input parasitic inductance in conjunction with
C
B
and its ESR create an LCR network. The input LCR can
be stimulated by the boost regulator switch current or load
current transients when the MOSFETs are on. To reduce
ringing associated with input inductance, C
B
should be:
C
B
4 L
IN
R
ESR
2
where C
B
is the capacitor value, R
ESR
is the capacitors
ESR and L
IN
is the inductance of the input lines.
While damped ringing is not necessarily bad, it may pro-
duce unexpected results as the LT4351 ideal diode reacts
to the varying V
IN
to OUT voltage. Typically an electrolytic
or tantalum low ESR capacitor would be used. Figure 7a
illustrates V
IN
for a low value of C
B
and Figure 7b shows
it with a correctly sized value.
Figure 7a. Example of Input Voltage Ringing
with Low C
IN
Capacitor at MOSFET Turn Off
Figure 7b. Example of Input Voltage with
Sufficient C
IN
Capacitor at MOSFET Turn Off
10µs/DIV
V
IN
200mV
4351 F07a
10µs/DIV
V
IN
200mV
4351 F07b
LT4351
12
4351fd
APPLICATIONS INFORMATION
As an example, for 500nH of inductance and R
ESR
of about
100mΩ, then:
C
4 500nF
0.1
2
= 20F
Check vendor data for ESR and iterate to get the best
value. Additional C
B
capacitance may be required for load
concerns.
If the boost regulator is being used, place a 10µF low ESR
ceramic capacitor from V
IN
to GND. Place a 10µF and a
0.1µF ceramic capacitor close to V
IN
and GND. These
capacitors should have low ESR (less than 10mΩ for the
10µF and 40mΩ for the 0.1µF). These capacitors help to
eliminate problems associated with noise produced by the
boost regulator. They are decoupled from the V
IN
supply
by a small 1Ω resistor, as shown in Figure 8. The LT4351
will perform better with a small ceramic capacitor (10µF)
on OUT to GND.
External Boost Supply
The V
DD
pin may be powered by an external supply. In
this case, simply omit the boost regulator inductor and
diode and leave the SW pin open. Suitable V
DD
capacitance
(minimum of a 1µF ceramic) should remain due to the
current pulses required for the gate driver.
The V
DD
current consists of 3.5mA of DC current with the
current required to charge the MOSFETs gate which is
dependent on the gate charge required and frequency of
switching. Typically the average current will be under 10mA.
MOSFET Selection
The LT4351 uses either a single N-channel MOSFET or
back-to-back N-channel MOSFETs as the pass element.
Back-to-back MOSFETs prevent the MOSFET body diode
from passing current.
Use a single MOSFET if current flow is allowable from
input to output when the input supply is above the output
(limited overvoltage protection). In this case the MOSFET
should have a source on the input side so the body diode
conducts current to the load. Back-to-back MOSFETs are
normally connected with their sources tied together to
provide added protection against exceeding maximum
gate to source voltage.
Selection of MOSFETs should be based on R
DS(ON)
, BV
DSS
and BV
GSS
. BV
DSS
should be high enough to prevent
breakdown when V
IN
or OUT are at their maximum value.
R
DS(ON)
should be selected to keep within the MOSFET
power rating at the maximum load current (I
2
• R
DS(ON)
)
BV
GSS
should be at least 8V. The LT4351 will clamp the
GATE to 7.5V above the lesser of V
IN
or OUT. For back-
to-back MOSFETs where sources are tied together, this
allows the use of MOSFETs with a VGS max rating of 8V
or more. If a single MOSFET is used, care must be taken
to ensure the VGS max rating is not exceeded. When the
MOSFET is turned off, the GATE voltage is near ground,
the source at V
IN
. Thus, MOSFET VGS max must be greater
than V
IN(MAX)
.
If a single MOSFET is used with source to V
IN
, then BV
GSS
should be greater than the maximum V
IN
since the MOSFET
gate is at 0.2V when off.
Figure 8. V
IN
Capacitors
V
IN
1
C
V3
10µF
C
V1
10µF
C
B
L
IN
PARASITIC
C
V2
0.1µF
V
IN
GATE
LT4351
4351 F08
GND

LT4351IMS#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Management Specialized - PMIC MOSFET Diode-OR Cntr
Lifecycle:
New from this manufacturer.
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