2
Absolute Maximum Ratings at T
A
= 25°C
Parameter Blue Units
Peak Forward Current 70 mA
DC Current
[1]
30 mA
Reverse Voltage Not recommended for reverse bias
Transient Forward Current
[2]
(10 µsec Pulse)
350 mA
LED Junction Temperature 115 °C
Operating Temperature –20 to +80 °C
Storage Temperature –30 to +100 °C
Wave Soldering Temperature [1.59 mm (0.063 in.) from Body] 250°C for 3 seconds
Solder Dipping Temperature [1.59 mm (0.063 in.) from Body] 260°C for 5 seconds
Notes:
1. Derate linearly from 50°C as shown in Figure 6.
2. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current.
Part Numbering System
Selection Guide
Part Number Package Viewing Angle
Luminous Intensity Iv (mcd)
Min. Max.
HLMP-KB45-A0000 T-1 40 30 –
HLMP-DB25-B0000 T-1¾ 25 40 –
Mechanical Option
00: Bulk
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle
25: 25 degrees
45: 40 degrees
Color Options
B: Blue
Package Options
D: T-1¾ (5 mm)
K: T-1 (3 mm)
HLMP - x x xx - x x x xx
