PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
BGA Package
24-Lead (22mm × 6.25mm × 2.06mm)
(Reference LTC DWG# 05-08-1991 Rev Ø)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
Øb (24 PLACES)
DETAIL B
SUBSTRATE
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
1.81
0.40
1.41
0.55
0.45
0.46
0.95
NOM
2.06
0.50
1.56
0.60
0.50
22.0
6.25
1.0
20.75
5.0
0.56
1.00
MAX
2.31
0.60
1.71
0.65
0.55
0.66
1.05
0.15
0.10
0.15
0.15
0.08
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 24
A2
D
E
SUGGESTED PCB LAYOUT
TOP VIEW
0.00
9.375
10.375
2.50
0.50
1.50
2.50
1.50
0.50
0.00
10.375
9.375
10.075
10.675
// bbb Z
Z
H2
H1
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
0.60 ±0.025 Ø 24x
2.80
2.20
BGA 24 1014 REV Ø
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
LTMXXXXXX
µModule
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
PACKAGE BOTTOM VIEW
X
W
V
U
T
S
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
123456
DETAIL A
3
SEE NOTES
PIN 1
e
e
F
G
b
7
SEE NOTES
b
