SIDC32D170H
Edited by INFINEON Technologies AI DP PSD CLS, L 4461A, Edition 2, 02.11.2004
Fast switching diode chip in EMCON 3 -Technology
This chip is used for:
• EUPEC power modules
FEATURES:
• 1700V EMCON 3 technology 200 µm chip
• soft, fast switching
• low reverse recovery charge
• small temperature coefficient
Applications:
• resonant applications, drives
A
Chip Type V
R
I
F
Die Size Package Ordering Code
SIDC32D170H
1700V
50A 5.7 x 5.7 mm
2
sawn on foil
Q67050-A4174-
A001
MECHANICAL PARAMETER:
Raster size 5.7 x 5.7
Area total / active 32.49 / 22.41
Anode pad size 3.68 x 3.68
mm
2
Thickness 200 µm
Wafer size 150 mm
Flat position 180 deg
Max. possible chips per wafer 442 pcs
Passivation frontside Photoimide
Anode metallization 3200 nm Al Si Cu
Cathode metallization
Ni Ag –system
suitable for epoxy and soft solder die bonding
Die bond electrically conductive glue or solder
Wire bond Al, ≤500µm
Reject Ink Dot Size ∅ 0.65mm; max 1.2mm
Recommended Storage Environment
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
