IRF3703PBF

02/02/04
www.irf.com 1
IRF3703PbF
SMPS MOSFET
HEXFET
®
Power MOSFET
l Synchronous Rectification
Benefits
Applications
l Low Gate Impedance to Reduce Switching
Losses
l Fully Avalanche Rated
V
DSS
R
DS(on)
max I
D
30V 2.8m 210A
Absolute Maximum Ratings
Notes through are on page 8
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 210
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 100 A
I
DM
Pulsed Drain Current 1000
P
D
@T
C
= 25°C Power Dissipation 230 W
P
D
@T
A
= 25°C Power Dissipation 3.8
Linear Derating Factor 1.5 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J,
T
STG
Junction and Storage Temperature Range -55 to + 175 °C
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.65
R
θCS
Case-to-Sink, Flat, Greased Surface 0.5 –– °C/W
R
θJA
Junction-to-Ambient ––– 62
Thermal Resistance
l Ultra Low On-Resistance
l Active ORing
TO-220AB
PD - 94971
l Lead-Free
IRF3703PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 30 –– –– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient
––– 0.028 ––– V/°C Reference to 25°C, I
D
= 1mA
2.3 2.8 V
GS
= 10V, I
D
= 76A
2.8 3.9 V
GS
= 7.0V, I
D
= 76A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= V
GS
, I
D
= 250µA
––– ––– 20
µA
V
DS
= 24V, V
GS
= 0V
––– ––– 250 V
DS
= 24V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 200 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -200
nA
V
GS
= -20V
Parameter Min. Typ. Max. Units Conditions
g
fs
Forward Transconductance 150 –– ––– S V
DS
= 24V, I
D
= 76A
Q
g
Total Gate Charge –– 209 –– I
D
= 76A
Q
gs
Gate-to-Source Charge ––– 62 ––– nC V
DS
= 24V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 42 ––– V
GS
= 10V,
t
d(on)
Turn-On Delay Time ––– 18 ––– V
DD
= 15V, V
GS
= 10V
t
r
Rise Time ––– 123 ––– I
D
= 76A
t
d(off)
Turn-Off Delay Time ––– 53 ––– R
G
= 1.8
t
f
Fall Time ––– 24 ––– V
GS
= 10V
C
iss
Input Capacitance ––– 8250 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 3000 ––– V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 290 ––– pF ƒ = 1.0MHz
C
oss
Output Capacitance ––– 10360 V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 3060 ––– V
GS
= 0V, V
DS
= 24V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 2590 ––– V
GS
= 0V, V
DS
= 0V to 24V
Dynamic @ T
J
= 25°C (unless otherwise specified)
ns
Parameter Typ. Max. Units
E
AS
Single Pulse Avalanche Energy ––– 1700 mJ
I
AR
Avalanche Current ––– 76 A
E
AR
Repetitive Avalanche Energy ––– 23 mJ
Avalanche Characteristics
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– 0.8 1.3 V T
J
= 25°C, I
S
= 76A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 80 120 ns T
J
= 25°C, I
F
= 76A, V
DS
= 16V
Q
rr
Reverse RecoveryCharge ––– 185 275 nC di/dt = 100A/µs
Diode Characteristics
210
1000
A
Static @ T
J
= 25°C (unless otherwise specified)
I
GSS
I
DSS
Drain-to-Source Leakage Current
R
DS(on)
Static Drain-to-Source On-Resistance
m
IRF3703PbF
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Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1
10
100
1000
10000
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
10
100
1000
10000
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V = 15V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 175 C
J
°
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
210AA

IRF3703PBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET 30V 1 N-CH HEXFET 2.8mOhms 209nC
Lifecycle:
New from this manufacturer.
Delivery:
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