VS-MBRB15..CT-M3, VS-MBR15..CT-1-M3
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Vishay Semiconductors
Revision: 03-Nov-17
2
Document Number: 96403
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Note
(1)
Pulse width < 300 μs, duty cycle < 2 %
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average
forward current
per leg
I
F(AV)
T
C
= 131 °C, rated V
R
7.5
A
per device 15
Maximum peak one cycle
non-repetitive surge
I
FSM
5 μs sine or 3 μs
rect. pulse
Following any rated load condition
and with rated V
RRM
applied
690
Surge applied at rated load conditions halfwave,
single phase, 60 Hz
150
Non-repetitive avalanche energy per leg E
AS
T
J
= 25 °C, I
AS
= 2 A, L = 3.5 mH 7 mJ
Repetitive avalanche current per leg I
AR
Current decaying linearly to zero in 1 μs
Frequency limited by T
J
maximum V
A
= 1.5 x V
R
typical
2A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop V
FM
(1)
15 A T
J
= 25 °C 0.84
V7.5 A
T
J
= 125 °C
0.57
15 A 0.72
Maximum instantaneous reverse current I
RM
(1)
T
J
= 25 °C
Rated DC voltage
0.1
mA
T
J
= 125 °C 15
Maximum junction capacitance C
T
V
R
= 5 V
DC
(test signal range 100 kHz to 1 MHz), 25 °C 400 pF
Typical series inductance L
S
Measured from top of terminal to mounting plane 8.0 nH
Maximum voltage rate of change dV/dt Rated V
R
10 000 V/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction temperature range T
J
-65 to +150
°C
Maximum storage temperature range T
Stg
-65 to +175
Maximum thermal resistance,
junction to case per leg
R
thJC
DC operation 3.0
°C/W
Typical thermal resistance,
case to heatsink
R
thCS
Mounting surface, smooth and greased 0.50
Maximum thermal resistance,
junction to ambient
R
thJA
DC operation 60
Approximate weight
2g
0.07 oz.
Mounting torque
minimum 6 (5)
kgf · cm
(lbf · in)
maximum 12 (10)
Marking device
Case style D
2
PAK (TO-263AB) MBRB1545CT
Case style TO-262AA MBR1545CT-1