TLHP4200, TLHP4201
www.vishay.com
Vishay Semiconductors
Rev. 1.7, 16-Mar-15
1
Document Number: 83389
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Intensity LED in Ø 3 mm Tinted Clear Package
DESCRIPTION
This series is housed in a 3 mm tinted, clear plastic package.
The wide viewing angle of these devices provides a high
brightness across a large field of view.
All packing units are categorized in luminous intensity and
color groups. That allows users to assemble LEDs with
uniform appearance.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
•Package: 3 mm
• Product series: standard
• Angle of half intensity: ± 22°
FEATURES
• Standard Ø 3 mm (T-1) package
• Small mechanical tolerances
• Suitable for DC and high peak current
• Wide viewing angle
• Very high intensity
• Luminous intensity and color categorized
• ESD-withstand voltage: up to 2 kV HBM
according to JESD22-A114-B
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Status lights
•Off / on indicator
• Background illumination
• Readout lights
• Maintenance lights
•Legend light
PARTS TABLE
PART COLOR
LUMINOUS INTENSITY
(mcd)
at I
F
(mA)
WAVELENGTH
(nm)
at I
F
(mA)
FORWARD VOLTAGE
(V)
at I
F
(mA)
TECHNOLOGY
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
TLHP4200 Pure green 2.5 7 - 10 555 - 565 10 - 2.4 3 20 GaP on GaP
TLHP4201 Pure green 6.3 - 20 10 555 - 565 10 - 2.4 3 20 GaP on GaP
TLHP4201-AS12Z Pure green 6.3 - 20 10 555 - 565 10 - 2.4 3 20 GaP on GaP
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
TLHP42..
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage V
R
6V
DC forward current T
amb
≤ 60 °C I
F
30 mA
Surge forward current t
p
≤ 10 μs I
FSM
1A
Power dissipation T
amb
≤ 60 °C P
V
100 mW
Junction temperature T
j
100 °C
Operating temperature range T
amb
-40 to +100 °C
Storage temperature range T
stg
-55 to +100 °C
Soldering temperature t ≤ 5 s, 2 mm from body T
sd
260 °C
Thermal resistance junction/ambient R
thJA
400 K/W