STPS8L30DEE-TR

Characteristics STPS8L30DEE
4/8 Doc ID 023251 Rev 1
Figure 7. Forward voltage drop versus
forward current
Figure 8. Thermal resistance junction to
ambient versus copper surface
under tab
I
FM
(A)
0.1
1.0
10.0
100.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
V
FM
(V)
T
j
=25 °C
(Maximum values)
T
j
=125 °C
(Typical values)
T
j
=125 °C
(Maximum values)
R
th(j-a)
(°C/W)
0
50
100
150
200
250
012345678910
PowerFLAT (3.3x3.3)
S
Cu
(cm²)
epoxy printed board FR4, copper thickness
=35µm
STPS8L30DEE Package information
Doc ID 023251 Rev 1 5/8
2 Package information
Epoxy meets UL94,V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 9. PowerFLAT-3.3x3.3-8L dimensions (definitions)
Table 5. PowerFLAT-8L dimensions (values)
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.95 1.00 1.05 0.037 0.039 0.041
A3 0.20 0.0079
A4 0.20 0.0079
b 0.30 0.37 0.44 0.012 0.015 0.017
D 3.20 3.30 3.40 0.126 0.130 0.134
D2 2.24 2.31 2.38 0.088 0.091 0.094
D3 1.60 1.67 1.74 0.063 0.066 0.069
e 0.65 0.026
E 3.20 3.30 3.40 0.126 0.130 0.134
E2 1.68 1.75 1.82 0.066 0.069 0.072
L 0.31 0.38 0.45 0.012 0.015 0.018
L1 0.55 0.62 0.69 0.22 0.024 0.027
L2 0.86 0.93 1.00 0.034 0.037 0.039
A4
D2
L
E2
L1
b
e
e/2
D3
L2
A
A3
E
E/2
D
D/2
a
nc
k
k
a
nc
Projection
Exposed pad
Index area
(D/2 x E/2)
Package information STPS8L30DEE
6/8 Doc ID 023251 Rev 1
Figure 10. Footprint (dimensions in mm)
3.50
1.75
1.75
1.79
0.52
0.21
1.25
0.42
0.80
2.28
3.50

STPS8L30DEE-TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers Switch Mode REC 8A 30V Vrrm 0.34V VF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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