EMIF07-LCD02F3

Application information EMIF07-LCD02F3
4/8 Doc ID 11639 Rev 3
2 Application information
Figure 8. Aplac model
Figure 9. Aplac parameters
MODEL = D2
Rline
MODEL = D1
Lbump Rbump LbumpRbump
bulk
I1
O1
MODEL = D3
Rbump
Lbump
Cbump
Rgnd
Lgnd
bulk
Rbump
Lbump
Cbump
Rgnd
Lgnd
Rbump
Lbump
Cbump
Rgnd
Lgnd
Rbump
Lbump
Cbump
Rgnd
Lgnd
aplacvar Rline 70
aplacvar C_d1 15p
aplacvar C_d2 15p
aplacvar C_d3 600p
aplacvar Ls 950pH
aplacvar Rs 150m
aplacvar Lbump 50pH
aplacvar Rbump 20m
aplacvar Cbump 150f
aplacvar Lgnd 50pH
aplacvar Rgnd 100m
aplacvar Rsub 10m
Diode D1
BV=7
IBV=1m
CJO=C_d1
M=0.28
RS=0.1
VJ=0.6
TT=100n
Diode D2
BV=7
IBV=1m
CJO=C_d2
M=0.28
RS=0.1
VJ=0.6
TT=100n
Diode D3
BV=7
IBV=1m
CJO=C_d3
M=0.28
RS=0.01
VJ=0.6
TT=100n
EMIF07-LCD02F3 Ordering information scheme
Doc ID 11639 Rev 3 5/8
3 Ordering information scheme
Figure 10. Ordering information scheme
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 11. Package dimensions
EMIF yy - xxx zz F3
EMI filter
Number of lines
Information
Package
x = resistance value (ohm)
z = capacitance value / 10 (pF)
or
3 letters = application
2 digits = version
F = Flip Chip
3 = Lead-free, pitch = 400 µm, bump = 255 µm
605 µm ± 55
1.94 mm ± 30µm
1.54 mm ± 30 µm
255 µm± 40
400 µm ± 40
400 µm ± 40
170 µm
170 µm
Ordering information EMIF07-LCD02F3
6/8 Doc ID 11639 Rev 3
Figure 14. Flip Chip tape and reel specification
Note: More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip : Package description and
recommendation for use”
AN1751: “EMI filters: Recommendations and measurements”
5 Ordering information
Figure 12. Footprint Figure 13. Marking
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4.0 ± 0.1
4.0 ± 0.1
2.0 ± 0.05
8.0 ± 0.3
1.75 ± 0.1
3.5 ± 0.1
Ø 1.55 ± 0.1
0.69 ± 0.05
1.71
0.20 ± 0.02
2.08
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
EMIF07-LCD02F3 GX Flip Chip 3.9 mg 5000 Tape and reel 7”

EMIF07-LCD02F3

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EMI Filter Circuits IPAD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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