
Data Sheet ADRF5044
Rev. 0 | Page 11 of 14
APPLICATIONS INFORMATION
EVALUATION BOARD
Figure 22 shows the top view of the ADRF5044-EVA L Z , and
Figure 23 shows the cross sectional view of the ADRF5044-EVA L Z .
Figure 22. Evaluation Board Layout, Top View
RO4003
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
W = 14mil
G = 5mil
T = 0.7mil
H = 8mil
TOTAL THICKNESS ≈ 62 mil
16313-023
Figure 23. Evaluation Board (Cross Sectional View)
The ADRF5044-EVA L Z is a 4-layer evaluation board. Each
copper layer is 0.7 mil (0.5 oz) and separated by dielectric
materials. All RF and dc traces are routed on the top copper
layer, and the inner and bottom layers are grounded planes that
provide a solid ground for the RF transmission lines. The top
dielectric material is 8 mil Rogers RO4003, offering optimal high
frequency performance. The middle and bottom dielectric
materials provide mechanical strength. The overall board
thickness is 62 mil, which allows 2.4 mm RF launchers to be
connected at the board edges.
The RF transmission lines were designed using a coplanar
waveguide (CPWG) model, with a trace width of 14 mil and a
ground clearance of 5 mil, to have a characteristic impedance
of 50 Ω. For optimal RF and thermal grounding, as many plated
through vias as possible are arranged around the transmission
lines and under the exposed pad of the package.
Figure 24 shows the actual ADRF5044 evaluation board with
component placement. Two power supply ports are connected
to the VDD and VSS test points (TP1 and TP4), control voltages
are connected to the V1 and V2 test points (TP2 and TP3), and
the ground reference is connected to the GND test point (TP5).
Figure 24. Evaluation Board Component Placement
On the control traces, V1 and V2, a 0 Ω resistor connects the
test points to the pins on the ADRF5044. On the supply traces,
VDD and VSS, a 100 pF bypass capacitor filters the high
frequency noise. Additionally, unpopulated components
positions are available for applying extra bypass capacitors.
The RF input and output ports (RFC, RF1, RF2, RF3, and RF4)
are connected through 50 Ω transmission lines to the 2.4 mm
RF launchers (J1 to J5). These high frequency RF launchers are
by contact and not soldered onto the board. A thru calibration
line connects the unpopulated J6 and J7 launchers; this
transmission line is used to estimate the loss of the PCB over
the environmental conditions being evaluated.
The schematic of the ADRF5044-EVA L Z is shown in Figure 25.