PR01, PR02, PR03
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Revision: 01-Mar-16
1
Document Number: 28729
For technical questions, contact: filmresistorsleaded@vishay.com
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Power Metal Film Leaded Resistors
DESCRIPTION
A homogeneous film of metal alloy is deposited on a high
grade ceramic body. After a helical groove has been cut in
the resistive layer, tinned connecting wires of electrolytic
copper or copper-clad iron are welded to the end-caps. The
resistors are coated with a red, non-flammable lacquer
which provides electrical, mechanical and climatic
protection. This coating is not resistant to aggressive fluxes
and cleaning solvents. The encapsulation is resistant to all
cleaning solvents in accordance with IEC 60068-2-45.
FEATURES
• High power in small packages (1 W / 0207 size
to 3 W / 0617 size)
• Defined fusing characteristics
• Technology: metal film
• Meets active and passive flammability
requirements as defined in IEC 60115-1
• AEC-Q200 qualified (PR01 and PR02)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• All general purpose power applications
• Automotive electronics
• Lighting ballast
Notes
(1)
R value is measured with probe distance of 24 mm ± 1 mm using 4-terminal method.
(2)
1 % tolerance is available for R
n
-range from 1 upwards.
TECHNICAL SPECIFICATIONS
DESCRIPTION PR01
PR02
Cu-lead
PR02
FeCu-lead
PR03
Cu-lead
PR03
FeCu-lead
DIN size 0207 0411 0411 0617 0617
Resistance range
(1)
0.22 to 1 M 0.33 to 1 M 1 to 1 M 0.68 to 1 M 1 to 1 M
Resistance tolerance
(2)
± 1 %; ± 5 % ± 1 %; ± 5 % ± 1 %; ± 5 % ± 1 %; ± 5 % ± 1 %; ± 5 %
Temperature coefficient ± 250 ppm/K ± 250 ppm/K ± 250 ppm/K ± 250 ppm/K ± 250 ppm/K
Rated dissipation, P
70
1 R 1 W 2 W 1.3 W 3 W 2.5 W
R < 1 0.6 W 1.2 W - 1.6 W -
Thermal resistance (R
th
) 135 K/W 75 K/W 115 K/W 60 K/W 75 K/W
Operating voltage, U
max.
AC/DC 350 V 500 V 500 V 750 V 750 V
E-series E24, E96 (± 1 %); E24 (± 5 %)
Basic specification IEC 60115-1
Stability after:
Endurance test (1000 h, P
70
) R max.: ± (5 % R + 0.1 )
Damp heat test (56 days) R max.: ± (3 % R + 0.1 )
Soldering (10 s, 260 °C) R max.: ± (1 % R + 0.05 )