Tflex
TM
HD400 Series
Thermal Gap Filler
Americas: +1.866.928.8181
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Product Description
Laird Tflex HD400 is a 4.0 W/mK gap filling material in our high deflection line of products. Tflex
HD400 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be
filled with Tflex HD400 while generating minimal board and component stress. Laird’s unique
manufacturing capabilities, filler and resin knowledge result in this advanced product designed with
customer applications in mind.
Tflex HD400 is provided in thickness from 0.5mm (.020”) up to 5mm (0.200”) in 0.25mm (.020”)
increments as standard. In addition, Laird can provide Tflex HD400 in multiple converted formats
through approved converters and distribution networks.
FEATURES AND BENEFITS
• 4.0 W/mK thermal conductivity
• Low pressure versus deflection
• Excellent surface wetting for low contact resistance
• Minimizes board and component stress
• Large tolerance applications
• RoHS and REACH compliant
SPECIFICATIONS
TYPICAL PROPERTIES VALUE TEST METHOD
Construction & Composition Ceramic filled silicone sheet N/A
Color Blue Visual
Thickness Range 0.5 mm (0.020”) - 5.0mm (0.20”) N/A
Thermal Conductivity (W/mK) 4.0 ASTM D5470
Density (g/cc) 3.0 Helium Pycnometer
Hardness (Shore 00) 44 ASTM D2240
Outgassing TML (weight %) 0.22 ASTM E595
Outgassing CVCM (weight %) 0.04 ASTM E595
Temperature Range -40°C to 200°C Laird Test Method
Rth@ 40 mils, 10 psi 0.36°C–in2/W ASTM D5470 (Modified)
Dielectric Constant @ 1 MHz 10.7 ASTM D150
UL Flammability Rating V-0 UL 94
Volume Resistivity 2.8 x 10
14
ASTM D257