BD6290EFV-E2

Technical Note
4/8
BD6290EFV
www.rohm.com
2012.02 - Rev.
A
© 2012 ROHM Co., Ltd. All rights reserved.
Points to notice for terminal description
PSPower save terminal
PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of 40μs(max.)
before it is returned from standby state to normal state and the motor output becomes ACTIVE.
PS State
L Standby state (RESET)
H ACTIVE
PHA1,PHA2Logic input terminal
These terminals decide output state.
PHAX OUTXA OUTXB
L L H
H H L
I01,I02,I11,I12Logic input terminal for DAC
These terminals decide internal DAC output voltage for current limit.
I0X I1X
Output current
level(%)
L L 100
H L 67
L H 33
H H 0
(I0X,I1X)=(H,H) : motor output are open.
Protection Circuits
Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above
175 (Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150 (Typ.), it
automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added
externally, heat overdrive can lead to destruction.
Over Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are
shorted each other or V
M
motor output or motor outputGND is shorted. This circuit latches the motor output to
OPEN condition when the regulated threshold current flows for 4μs (Typ.). It returns with power reactivation or a reset
of the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular
situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets
should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continue
and the return by power reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates
repeatedly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the
wiring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute
maximum values may be exceeded and as a result, there is a possibility of destruction. Also, when current which is
over the output current rating and under the OCP detection current flows, the IC can heat up to over T
jmax
=150 and
can deteriorate, so current which exceeds the output rating should not be applied.
Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage. When the applied voltage to the V
M
terminal goes under 15V (Typ.), the motor output is set to OPEN.
This switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this
circuit does not operate during power save mode.
Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VM terminal goes over 32V (Typ.), the motor output is set to OPEN. This
switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc.
Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum
value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be
aware that this circuit does not operate during power save mode.
False operation prevention function in no power supply (Ghost Supply Prevention)
If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false
operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to
the V
M
, to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is
supplied to the logic control input terminal while there is no power supply.
Technical Note
5/8
BD6290EFV
www.rohm.com
2012.02 - Rev.
A
© 2012 ROHM Co., Ltd. All rights reserved.
Power dissipation
HTSSOP-B24 Package
HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also,
the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing
power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is
a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat
dissipation efficiency.
Fig.2 HTSSOP-B24 Derating curve
Power DissipationPd[W]
Ambient Temperature:Ta[]
1.0
100 125
0
4.0W
4
2.8W
3
1.7W
2
1.1W
1
2.0
3.0
4.0
5.0
Measurement machineTH156Kuwano Electric
Measurement conditionROHM board
Board size70*70*1.6mm
3
(With through holes on the board)
The exposed metal of the backside is connected to the board with
solder.
Board①:1-layer board(Copper foil on the back 0mm
2
)
Board②:2-layer board(Copper foil on the back 15*15mm
2
)
Board③:2-layer board(Copper foil on the back 70*70mm
2
)
Board④:4-layer board(Copper foil on the back 70*70mm
2
)
Board①:θ
ja
=113.6/W
Board②:θ
ja
=73.5/W
Board③:θ
ja
=44.6/W
Board④:θ
ja
=31.3/W
Technical Note
6/8
BD6290EFV
www.rohm.com
2012.02 - Rev.
A
© 2012 ROHM Co., Ltd. All rights reserved.
Usage Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down
the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will
expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
(4) GND Potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that BD6290EFV has been designed to expose their frames at the back of the package, and
should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern
should be taken as possible, not only on the front of the baseboard but also on the back surface.
(6) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
(7) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes T
jmax
=150, and higher, coil output to the
motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect
or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment.
TSD on temperature [] (Typ.) Hysteresis Temperature [] (Typ.)
175 25
(10) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.

BD6290EFV-E2

Mfr. #:
Manufacturer:
Description:
Motor / Motion / Ignition Controllers & Drivers STEP MOTOR DRIVER 19-28V 0.8A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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