INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
2/23/04
• Low VCE (on) Non Punch Through IGBT Technology.
• Low Diode VF.
• 10µs Short Circuit Capability.
• Square RBSOA.
• Ultrasoft Diode Reverse Recovery Characteristics.
• Positive VCE (on) Temperature Coefficient.
• Lead-Free
Benefits
www.irf.com 1
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
IRGR3B60KD2PbF
E
G
n-channel
C
V
CES
= 600V
I
C
= 4.2A, T
C
=100°C
t
sc
> 10µs, T
J
=150°C
V
CE(on)
typ. = 1.9V
D-Pak
Absolute Maximum Ratings
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C
Continuous Collector Current 7.8 A
I
C
@ T
C
= 100°C
Continuous Collector Current 4.2
I
CM
Pulse Collector Current (Ref.Fig.C.T.5) 15.6
I
LM
Clamped Inductive Load current
15.6
I
F
@ Tc = 25°C
Diode Continous Forward Current 6.0
I
F
@ Tc = 100°C
Diode Continuous Forward Current 3.2
I
FM
Diode Maximum Forward Current 15.6
V
GE
Gate-to-Emitter Voltage ±20 V
P
D
@ T
C
= 25°C
Maximum Power Dissipation 52 W
P
D
@ T
C
= 100°C
Maximum Power Dissipation 21
T
J
Operating Junction and -55 to +150
T
STG
Storage Temperature Range °C
Soldering Temperature Range, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Thermal / Mechanical Characteristics
Parameter Min. Typ. Max. Units
R
θ
JC
Junction-to-Case- IGBT ––– ––– 2.4 °C/W
R
θ
JC
Junction-to-Case- Diode ––– ––– 8.8
R
θ
JA
Junction-to-Ambient, (PCB Mount)
––– –– 50
Wt
Weight –– 0.3 ––– g
PD - 95036
IRGR3B60KD2PbF
2 www.irf.com
V
CC
= 80% (V
CES
), V
GE
= 15V, L = 100µH, R
G
= 100Ω.
When mounted on 1" square PCB (FR-4 or G-10 Material ) . For recommended
footprint and soldering techniques refer to application note #AN-994.
Energy losses include "tail" and diode reverse recovery.
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Ref.Fig.
V
(BR)CES
Collector-to-Emitter Breakdown Voltage
600——V
V
GE
= 0V, I
C
= 500µA
V
(BR)CES
/T
J
Temperature Coeff. of Breakdown Volta
g
e —0.32—V/°C
V
GE
= 0V, I
C
= 1mA (25°C-150°C)
V
CE(on)
Collector-to-Emitter Voltage 1.9 2.4
I
C
= 3.0A, V
GE
= 15V
5,6,7
—2.22.6V
I
C
= 3.0A, V
GE
= 15V, T
J
= 150°C
9,10,11
V
GE(th)
Gate Threshold Voltage 3.5 4.5 5.5
V
CE
= V
GE
, I
C
= 250µA
9,10,11
V
GE(th)
/
T
J
Threshold Voltage temp. coefficient -8.5 mV/°
C
V
CE
= V
GE
, I
C
= 1mA (25°C-150°C)
12
gfe Forward Transconductance 1.9 S
V
CE
= 50V, I
C
= 3.0A, PW = 80µs
I
CES
Zero Gate Voltage Collector Current 1.0 150 µA
V
GE
= 0V, V
CE
= 600V
200 500
V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
V
FM
Diode Forward Voltage Drop 1.5 1.8 V
I
F
= 3.0A, V
GE
= 0V
8
—1.51.8
I
F
= 3.0A, V
GE
= 0V, T
J
= 150°C
I
GES
Gate-to-Emitter Leakage Current ±100 nA
V
GE
= ±20V, V
CE
= 0V
Switchin
g
Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Ref.Fig.
Q
g
Total Gate Charge (turn-on) 13 20
I
C
= 3.0A
23
Q
ge
Gate-to-Emitter Charge (turn-on) 1.5 2.3 nC
V
CC
= 400V
CT1
Q
gc
Gate-to-Collector Charge (turn-on) 6.6 9.9
V
GE
= 15V
E
on
Turn-On Switching Loss 62 75
I
C
= 3.0A, V
CC
= 400V
CT4
E
off
Turn-Off Switching Loss 39 50 µJ
V
GE
= 15V, R
G
= 100, L = 2.5mH
E
tot
Total Switching Loss 100 120
T
J
= 25°C
t
d(on)
Turn-On delay time 18 22
I
C
= 3.0A, V
CC
= 400V
t
r
Rise time 15 21 ns
V
GE
= 15V, R
G
= 100
, L = 2.5mH
CT4
t
d(off)
Turn-Off delay time 110 120
T
J
= 25°C
t
f
Fall time 68 80
E
on
Turn-On Switching Loss 91 100
I
C
= 3.0A, V
CC
= 400V
CT4
E
off
Turn-Off Switching Loss 98 140 µJ
V
GE
= 15V, R
G
= 100
, L = 2.5mH
13,15
E
tot
Total Switching Loss 190 230
T
J
= 150°C
WF1,WF2
t
d(on)
Turn-On delay time 18 22
I
C
= 3.0A, V
CC
= 400V
14,16
t
r
Rise time 17 22 ns
V
GE
= 15V, R
G
= 100, L = 2.5mH
CT4
t
d(off)
Turn-Off delay time 120 140
T
J
= 150°C
WF1
t
f
Fall time 91 105
WF2
C
ies
Input Capacitance 190
V
GE
= 0V
C
oes
Output Capacitance 23 pF
V
CC
= 30V
22
C
res
Reverse Transfer Capacitance 6.6 f = 1.0MHz
RBSOA Reverse Bias Safe Operating Area FULL SQUARE
T
J
= 150°C, I
C
= 15.6A, Vp = 600V
4
V
CC
=500V,V
GE
=+15V to 0V,R
G
= 100
CT2
SCSOA Short Circuit Safe Operating Area 10 µs
T
J
= 150°C, Vp = 600V, R
G
= 100
CT3
V
CC
=360V,V
GE
= +15V to 0V
WF4
Erec Reverse Recovery Energy of the Diode 38 44 µJ
T
J
= 150°C
17,18,19
t
rr
Diode Reverse Recovery Time 77 84 ns
V
CC
= 400V, I
F
= 3.0A, L = 2.5mH
20,21
I
rr
Diode Peak Reverse Recovery Current 4.8 5.3 A
V
GE
= 15V, R
G
= 100
CT4,WF3
IRGR3B60KD2PbF
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Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
Fig. 2 - Power Dissipation vs. Case
Temperature
Fig. 3 - Forward SOA
T
C
= 25°C; T
J
150°C
Fig. 4 - Reverse Bias SOA
T
J
= 150°C; V
GE
=15V
0 20 40 60 80 100 120 140 160
T
C
(°C)
0
10
20
30
40
50
60
P
t
o
t
(
W
)
10 100 1000
V
CE
(V)
0
1
10
100
I
C
A
)
1 10 100 1000 10000
V
CE
(V)
0.01
0.1
1
10
100
I
C
(
A
)
100 µs
10ms
DC
1ms
10 µs
0 20 40 60 80 100 120 140 160
T
C
(°C)
0
2
4
6
8
10
I
C
(
A
)

IRGR3B60KD2TRRP

Mfr. #:
Manufacturer:
Infineon / IR
Description:
IGBT Transistors IGBT DISCRETES
Lifecycle:
New from this manufacturer.
Delivery:
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