MSD30-08

MSD30
MSD30 Rev 0 www.microsemi.com
Dec, 2009 1/3
Module Type
TYPE V
RRM
V
RSM
MSD30-08
MSD30-12
MSD30-16
MSD30-18
800V
1200V
1600V
1800V
900V
1300V
1700V
1900V
Maximum Ratings
Symbol Conditions Values Units
ID
Tc=85
30 A
IFSM
t=10mS Tv
j
=45
300 A
i
2
t
t=10mS Tv
j
=45
450 A
2
s
Visol a.c.50Hz;r.m.s.;1min 3000 V
Tvj -40 to 150
Tstg -40 to 125
Ms To heatsink(M5) 3±5% Nm
Weight Module 78 g
Thermal Characteristics
Symbol Conditions Values Units
Rth(j-c) Per diode 1.5
/
W
Rth(c-s) Module 0.2
/
W
Electrical Characteristics
Circuit
Glass Passivated Three
Phase Rectifier Bridge
V
RRM 800 to 1800V
ID 30 Amp
Features
y Three phase bridge rectifier
y Blocking voltage:800 to 1800V
y Heat transfer through aluminum oxide DCB
ceramic isolated metal baseplate
y Glass passivated chip
Applications
y Three phase rectifiers for power supplies
y Rectifiers for DC motor field supplies
y Battery charger rectifiers
y In
p
ut rectifiers for variable fre
q
uenc
y
drives
4
3
7
2
1
MSD
Symbol Conditions Values Units
VFM
T=25 IFM =100A
1.6 V
IRD
Tvj =25 VRD=VRRM
Tvj =150 VRD=VRRM
0.2
3
mA
mA
MSD30
MSD30 Rev 0 www.microsemi.com
Dec, 2009 2/3
Performance Curves
Fig1. Forward Characteristics
Fig3. Transient thermal impedance
Fi
g
2. Power dissi
p
ation
Fig4. Max Non-Repetitive Forward Surge
Current
Fig5.Forward Current Derating Curve
Typ.
25
125
Zth(j-C)
200
A
150
100
50
IF
0
0 VF 0.5 1.0 1.5 2.0 V
1 10 cycles 100
600
A
400
200
0
0 Tc 50 100 150
ID
50
A
40
30
0
20
10
0.001 0.01 0.1 1 10 100 S
1.5
1.0
0.5
0
2.0
/ W
0 ID 15 30 A
50HZ
W
0
70
35
P
vtot
MSD30
MSD30 Rev 0 www.microsemi.com
Dec, 2009 3/3
Package Outline Information
CASE-M1
Dimensions in mm

MSD30-08

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Discrete Semiconductor Modules Power Module - Diode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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