MPX12
Sensors
4 Freescale Semiconductor
Pressure
Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Uncompensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Table 2. Maximum Ratings
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum Pressure (P1 > P2) P
MAX
75 kPa
Burst Pressure (P1 > P2) P
BURST
100 kPa
Storage Temperature T
STG
–40 to +125 °C
Operating Temperature T
A
40 to +125 °C
1
2
3
4
GND
+V
OUT
–V
OUT
+V
S
Sensing
Element
MPX12
Sensors
Freescale Semiconductor 5
Pressure
Temperature Compensation
Figure 2 shows the typical output characteristics of the
MPX12 series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components, or
by designing your system using the MPX2010D series sensor.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: V
OUT
= V
OFF
+ sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Figure 2. Output vs. Pressure Differential
Figure 3. Linearity Specification Comparison
Pressure Differential
Output (mVdc)
80
70
60
50
40
30
20
10
0
0
0.3
2.0
0.6
4.0
0.9
6.0
1.2
8.0 10
1.5
PSI
kPa
Span
Range
(Typ)
Offset
(Typ)
V
S
= 3 V
DC
P1 > P2
-40°C
+25°C
+125°C
Linearity
Actual
Theoretical
Offset
(V
OFF
)
Max
P
OP
Output (mVdc)
Pressure (kPa)
70
60
50
40
30
20
10
0
0
Span
(V
FSS
)
80
MPX12
Sensors
6 Freescale Semiconductor
Pressure
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential/gauge die. A gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
Operating characteristics, internal reliability and
qualification tests are based on use of dry clean air as the
pressure media. Media other than dry clean air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing gel which isolates
the die from the environment. Freescale’s MPx12 series is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Differential Sensing
Element
P2
Lead Frame
Part Number Case Type
Pressure (P1) Side
Identifier
MPX12D
344 Stainless Steel Cap
MPX12DP
344C Side with Part Marking
MPX12GP
344B Side with Port Attached
MPXV12DP
1351 Side with Part Marking
MPXV12GP
1369 Side with Port
MPXV12GW6U
1735 Side with Port
MPXV12GW7U
1560 Side with Port
MPXM12GS/GST1
1320A Side with Port Attached

MPX12D

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors PRESS SEN UNCOMP 12KPA
Lifecycle:
New from this manufacturer.
Delivery:
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