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MPX12DP

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
MPX12
Sensors
10 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX12
Sensors
Freescale Semiconductor 11
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
NOTES:
1.
2.
3.
4.
CONTROLLING DIMENSION: INCH.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
N
A
C
0.004 (0.1)
DETAIL G
SEATING
PLANE
8X
P
T
∅
D
E
e/2
e
A
M
0.004 (0.1) BC
E1
A
B
A0.008 (0.20) B
C
8X b
2 PLACES 4 TIPS
1
4
8
5
F
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.300 0.330 7.11 7.62
A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E
E1 0.465 0.485 11.81 12.32
e
M 0.270 0.290 6.86 7.36
N 0.080 0.090 2.03 2.28
P 0.009 0.011 0.23 0.28
T 0.115 0.125 2.92 3.17
0.100 BSC 2.54 BSC
F 0.245 0.255 6.22 6.47
K 0.120 0.130 3.05 3.30
L 0.061 0.071 1.55 1.80
0˚ 7˚ 0˚ 7˚
θ
0.717 BSC 18.21 BSC
K
M
GAGE
PLANE
DETAIL G
L
A1
θ
.014 (0.35)
MPX12
Sensors
12 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1735-02
ISSUE B
SMALL OUTLINE PACKAGE
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

MPX12DP

Mfr. #:
Buy MPX12DP
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors PRES SEN UNCOMP 12KPA
Lifecycle:
New from this manufacturer.
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