MPX12
Sensors
Freescale Semiconductor 7
Pressure
PACKAGE DIMENSIONS
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
STYLE 2:
PIN 1. V
CC
2. – SUPPLY
3. + SUPPLY
4. GROUND
M
A
M
0.136 (0.005) T
1234
PIN 1
R
N
L
G
F
D
4 PL
SEATING
PLANE
–T–
C
M
J
B
–A–
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M 30 NOM 30 NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
STYLE 3:
PIN 1. GND
2. –VOUT
3. VS
4. +VOUT
DAMBAR TRIM ZONE:
F
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
1
23
4
Y
Z
Y 0.048 0.052 1.22 1.32
Z 0.106 0.118 2.68 3.00
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
SEATING
PLANE
B
N
R
C
J
–T–
D
F
U
H
L
PORT #1
POSITIVE
PRESSURE
PIN 1
–A–
–Q–
S
K
G
4 PL
–P–
S
Q
M
0.25 (0.010) T
S
S
M
0.13 (0.005) Q
S
T
12 34
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.230 0.250 5.84 6.35
S
U 0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
(P1)
