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TFA9842AJ/N1,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
TFA9842AJ_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary specification Rev. 01 — 28 April 2006 13 of 18
Philips Semiconductors
TFA9842AJ
7.5 W stereo power amplifier with volume control
R
th(tot)
=(T
j(max)
− T
amb(max)
)/P
At V
CC
= 17 V and R
L
=4Ω (2 × SE) the measured worst-case sine-wave dissipation is
8.4 W; see Figure 8. For T
j(max)
= 150 °C the temperature raise, caused by the power
dissipation, is: 150 °C − 60 °C=90°C:
P × R
th(tot)
=90°C
R
th(tot)
= 90/8.4 K/W = 10.7 K/W
R
th(h-a)
=R
th(tot)
− R
th(j-mb)
= 10.7 K/W − 2.0 K/W = 8.7 K/W
This calculation is for an application at worst-case (stereo) sine-wave output signals. In
practice music signals will be applied, which decreases the maximum power dissipation to
approximately half of the sine-wave power dissipation (see Section 8.2.2). This allows for
the use of a smaller heatsink:
P × R
th(tot)
=90°C
R
th(tot)
= 90/4.2 K/W = 21.4 K/W
R
th(h-a)
=R
th(tot)
− R
th(j-mb)
= 21.4 K/W − 2.0 K/W = 19.4 K/W
14. Test information
14.1 Quality information
The
General Quality Specification for Integrated Circuits, SNW-FQ-611
is applicable.
2 × SE loads; T
amb
=25°C; external heatsink of 10 K/W; music signals
Fig 16. Junction temperature as function of supply voltage
8
150
100
50
0
12 28
V
CC
(V)
16 20 24
001aaa449
T
j
(°C)
4 Ω
R
L
= 2 Ω
6 Ω
8 Ω
16 Ω
TFA9842AJ_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary specification Rev. 01 — 28 April 2006 14 of 18
Philips Semiconductors
TFA9842AJ
7.5 W stereo power amplifier with volume control
15. Package outline
Fig 17. Package outline SOT523-1 (DBS9P)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D
1
may protrude 0.04 mm maximum.
SOT523-1
0 10 mm5
scale
w M
b
p
D
h
q
1
Z
19
e
e
1
m
e
2
x
A
2
non-concave
D
1
D
P
k
q
2
L
3
L
2
L
Qc
E
00-07-03
03-03-12
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
view B: mounting base side
B
UNIT b
p
L
1
cD
(1)
D
h
Lq
2
mm
2.7
2.3
A
2
(2)
0.80
0.65
0.58
0.48
13.2
12.8
D
1
(2)
6.2
5.8
3.5
E
h
3.5
e
2.54
e
1
1.27
e
2
5.08 4.85
QE
(1)
14.7
14.3
Z
(1)
1.65
1.10
11.4
10.0
L
2
6.7
5.5
L
3
4.5
3.7
3.4
3.1
1.15
0.85
q
17.5
16.3
q
1
2.8
m
0.8
v
3.8
3.6
3
2
12.4
11.0
Pk
0.02
x
0.3
w
E
h
L
1
q
v M
TFA9842AJ_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary specification Rev. 01 — 28 April 2006 15 of 18
Philips Semiconductors
TFA9842AJ
7.5 W stereo power amplifier with volume control
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
16.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
Table 10. Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

TFA9842AJ/N1,112

Mfr. #:
Buy TFA9842AJ/N1,112
Manufacturer:
NXP Semiconductors
Description:
IC AMP AUDIO PWR 7.5W STER 9SIL
Lifecycle:
New from this manufacturer.
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