7SB3257MUTCG

7SB3257
http://onsemi.com
4
AC Loading and Waveforms
Figure 4. Load Circuit and Voltage Waveforms
500 W
C
L
= 50 pF
(see Note A)
7 V
From Output
Under Test
500 W
S1
Open
GND
LOAD CIRCUIT
TEST S1
t
PD
t
PLZ
/t
PZL
t
PHZ
/t
PZH
Open
7 V
GND
Input
1.5 V
1.5 V
1.5 V
1.5 V
t
PLH
t
PHL
Output
3 V
V
OH
0 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
t
PZL
3 V
1.5 V
1.5 V
0 V
Output
Control
t
PLZ
t
PZH
t
PHZ
1.5 V
1.5 V
3.5 V
0 V
V
OL
V
OH
V
OL
+ 0.3 V
V
OH
− 0.3 V
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z
O
= 50 W, t
r
2.5 ns, t
f
2.5 ns.
D. The output is measured with one input transition per measurement.
E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as t
en
.
G. t
PLH
and t
PHL
are the same as t
pd
.
DEVICE ORDERING INFORMATION
Device Package Shipping
7SB3257DTT1G
TSOP−6
(Pb−Free)
3000 / Tape & Reel
NLV7SB3257DTT1G*
7SB3257DTT2G
7SB3257DFT2G SC−88
(Pb−Free)
3000 / Tape & Reel
7SB3257AMX1TCG ULLGA6 − 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
7SB3257BMX1TCG ULLGA6 − 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
7SB3257CMX1TCG ULLGA6 − 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
7SB3257MU1TCG UDFN6 − 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
7SB3257MUTCG UDFN6 − 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
7SB3257MU3TCG UDFN6 − 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
7SB3257
http://onsemi.com
5
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
23
456
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX
MILLIMETERS
0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
e 0.85 0.95 1.05
L 0.20 0.40 0.60
0.25 BSC
L2
0° 10°
1.30 1.50 1.70
E1
E
RECOMMENDED
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
DETAIL Z
0.60
6X
3.20
0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
M
7SB3257
http://onsemi.com
6
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
E0.2 (0.008)
MM
123
D
e
A1
A
A3
C
L
654
−E−
b
6 PL
DIM MIN NOM MAX
MILLIMETERS
A 0.80 0.95 1.10
A1 0.00 0.05 0.10
A3
b 0.10 0.21 0.30
C 0.10 0.14 0.25
D 1.80 2.00 2.20
0.031 0.037 0.043
0.000 0.002 0.004
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.20 REF 0.008 REF
H
E
H
E
E 1.15 1.25 1.35
e 0.65 BSC
L 0.10 0.20 0.30
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
ǒ
mm
inches
Ǔ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

7SB3257MUTCG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Bus Transmitters 1 BIT MUX/DEMUX
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union