P89LV51RB2_RC2_RD2_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 15 December 2009 61 of 76
NXP Semiconductors
P89LV51RB2/RC2/RD2
8-bit microcontrollers with 80C51 core
Table 58. Clock doubling features
Device Standard mode (X1) Clock double mode (X2)
Clocks per
machine cycle
Maximum
external clock
frequency (MHz)
Clocks per
machine cycle
Maximum
external clock
frequency (MHz)
P89LV51RB2/RC2/RD2 12 33 6 16
Table 59. FST - Flash status register (address B6) bit allocation
Not Bit addressable; reset value: xxxx x0xxB.
Bit 7 6 5 4 3 2 1 0
Symbol - SB - - EDC - - -
Table 60. FST - Flash status register (address B6) bit descriptions
Bit Symbol Description
7 - Reserved for future use. Should be set to ‘0’ by user programs.
6 SB Security bit.
5 to 4 - Reserved for future use. Should be set to ‘0’ by user programs.
3 EDC Enable double clock.
2 to 0 - Reserved for future use. Should be set to ‘0’ by user programs.
P89LV51RB2_RC2_RD2_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 15 December 2009 62 of 76
NXP Semiconductors
P89LV51RB2/RC2/RD2
8-bit microcontrollers with 80C51 core
7. Limiting values
8. Static characteristics
Table 61. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
Symbol Parameter Conditions Min Max Unit
T
amb(bias)
bias ambient temperature 55 +125 °C
T
stg
storage temperature 65 +150 °C
V
I
input voltage on EA pin to V
SS
0.5 +14 V
V
n
voltage on any other pin except V
SS
; with respect to
V
DD
0.5 V
DD
+ 0.5 V
I
OL(I/O)
LOW-level output current per
input/output pin
pins P1.5, P1.6, P1.7 - 20 mA
all other pins - 15 mA
P
tot(pack)
total power dissipation per package based on package heat
transfer, not device power
consumption
- 1.5 W
Table 62. Static characteristics
T
amb
=0
°
C to +70
°
C or
40
°
Cto+85
°
C; V
DD
= 2.7 V to 3.6 V; V
SS
=0V.
Symbol Parameter Conditions Min Max Unit
n
endu(fl)
endurance of flash memory JEDEC Standard A117
[1]
10000 - cycles
t
ret(fl)
flash memory retention time JEDEC Standard A103
[1]
100 - years
I
latch
I/O latch-up current JEDEC Standard 78
[1]
100 + I
DD
-mA
V
IL
LOW-level input voltage 2.7 V < V
DD
< 3.6 V 0.5 +0.7 V
V
IH
HIGH-level input voltage 2.7 V < V
DD
< 3.6 V 0.2V
DD
+ 0.9 V
DD
+ 0.5 V
XTAL1, RST 0.7V
DD
V
DD
+ 0.5 V
V
OL
LOW-level output voltage V
DD
= 2.7 V; ports 1.5, 1.6,
1.7
I
OL
=16mA - 1.0 V
V
DD
= 2.7 V; ports 1, 2, 3,
except
PSEN, ALE
[2][3][4]
I
OL
= 100 µA - 0.3 V
I
OL
= 1.6 mA - 0.45 V
I
OL
= 3.5 mA - 1.0 V
V
DD
= 2.7 V; port 0, PSEN,
ALE
I
OL
= 200 µA - 0.3 V
I
OL
= 3.2 mA - 0.45 V
P89LV51RB2_RC2_RD2_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 15 December 2009 63 of 76
NXP Semiconductors
P89LV51RB2/RC2/RD2
8-bit microcontrollers with 80C51 core
[1] This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
[2] Under steady state (non-transient) conditions, I
OL
must be externally limited as follows:
a) Maximum I
OL
per 8-bit port: 26 mA
b) Maximum I
OL
total for all outputs: 71 mA
c) If I
OL
exceeds the test condition, V
OH
may exceed the related specification. Pins are not guaranteed to sink current greater than the
listed test conditions.
[3] Capacitive loading on Ports 0 and 2 may cause spurious noise to be superimposed on the V
OL
of ALE and Ports 1 and 3. The noise due
to external bus capacitance discharging into the Port 0 and 2 pins when the pins make 1-to-0 transitions during bus operations. In the
worst cases (capacitive loading > 100 pF), the noise pulse on the ALE pin may exceed 0.8 V. In such cases, it may be desirable to
qualify ALE with a Schmitt trigger, or use an address latch with a Schmitt trigger STROBE input.
[4] Load capacitance for Port 0, ALE and PSEN = 100 pF, load capacitance for all other outputs = 80 pF.
[5] Capacitive loading on Ports 0 and 2 may cause the V
OH
on ALE and PSEN to momentarily fall below the V
DD
0.7 V specification when
the address bits are stabilizing.
[6] Pins of Ports 1, 2 and 3 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its
maximum value when V
I
is approximately 2 V.
[7] Pin capacitance is characterized but not tested. Pin EA = 25 pF (max).
V
OH
HIGH-level output voltage V
DD
= 2.7 V; ports 1, 2, 3,
ALE,
PSEN
[5]
I
OH
= 10 µAV
DD
0.3 - V
I
OH
= 30 µAV
DD
0.7 - V
I
OH
= 60 µAV
DD
1.5 - V
V
DD
= 2.7 V; port 0 in
External Bus mode
I
OH
= 200 µAV
DD
0.3 - V
I
OH
= 3.2 mA V
DD
0.7 - V
V
bo
brownout trip voltage 2.35 2.55 V
I
IL
LOW-level input current V
I
= 0.4 V; ports 1, 2, 3 - 75 µA
I
THL
HIGH-LOW transition current V
I
= 2 V; ports 1, 2, 3
[6]
- 650 µA
I
LI
input leakage current 0.45 V < V
I
<V
DD
0.3 V;
port 0
- ±10 µA
R
pd
pull-down resistance on pin RST - 225 k
C
iss
input capacitance 1 MHz; T
amb
=25°C
[7]
-15pF
I
DD(oper)
operating supply current f
osc
= 12 MHz - 11.5 mA
f
osc
= 33 MHz - 30 mA
I
DD(idle)
Idle mode supply current f
osc
= 12 MHz - 8.5 mA
f
osc
= 33 MHz - 21 mA
I
DD(pd)
Power-down mode supply
current
minimum V
DD
=2V
T
amb
= 0 °C to +70 °C- 45µA
T
amb
= 40 °C to +85 °C- 55µA
Table 62. Static characteristics
…continued
T
amb
=0
°
C to +70
°
C or
40
°
Cto+85
°
C; V
DD
= 2.7 V to 3.6 V; V
SS
=0V.
Symbol Parameter Conditions Min Max Unit

P89LV51RD2BBC,557

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC MCU 8BIT 64KB FLASH 44TQFP
Lifecycle:
New from this manufacturer.
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