ISL6612BECBZ

1
®
FN9205.4
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005-2006, 2012. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL6612B, ISL6613B
Advanced Synchronous Rectified Buck
MOSFET Drivers with Pre-POR OVP
The ISL6612B and ISL6613B are high frequency MOSFET
drivers specifically designed to drive upper and lower power
N-Channel MOSFETs in a synchronous rectified buck
converter topology. These drivers combined with HIP63xx or
ISL65xx Multi-Phase Buck PWM controllers and N-Channel
MOSFETs form complete core-voltage regulator solutions for
advanced microprocessors.
The ISL6612B drives the upper gate to above rising VCC
POR (7V), while the lower gate can be independently driven
over a range from 5V to 12V. The ISL6613B drives both
upper and lower gates over a range of 5V to 12V. This drive-
voltage provides the flexibility necessary to optimize
applications involving trade-offs between gate charge and
conduction losses. These drivers are optimized for POL
DC/DC Converters for IBA Systems.
An advanced adaptive zero shoot-through protection is
integrated to prevent both the upper and lower MOSFETs
from conducting simultaneously and to minimize the dead
time. These products add an overvoltage protection feature
operational before VCC exceeds its turn-on threshold, at
which the PHASE node is connected to the gate of the low
side MOSFET (LGATE). The output voltage of the converter
is then limited by the threshold of the low side MOSFET,
which provides some protection to the microprocessor if the
upper MOSFET(s) is shorted during initial start-up.
These drivers also feature a three-state PWM input which,
working together with Intersil’s multi-phase PWM controllers,
prevents a negative transient on the output voltage when the
output is shut down. This feature eliminates the Schottky
diode that is used in some systems for protecting the load
from reversed output voltage events.
Features
Pin-to-pin Compatible with HIP6601 SOIC family
Dual MOSFET Drives for Synchronous Rectified Bridge
Low VCC Rising Threshold (7V) for IBA Applications.
Advanced Adaptive Zero Shoot-Through Protection
- Body Diode Detection
- Auto-zero of r
DS(ON)
Conduction Offset Effect
Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency
36V Internal Bootstrap Schottky Diode
Bootstrap Capacitor Overcharging Prevention
Supports High Switching Frequency (up to 2MHz)
- 3A Sinking Current Capability
- Fast Rise/Fall Times and Low Propagation Delays
Three-State PWM Input for Output Stage Shutdown
Three-State PWM Input Hysteresis for Applications With
Power Sequencing Requirement
Pre-POR Overvoltage Protection
VCC Undervoltage Protection
Expandable Bottom Copper Pad for Enhanced Heat
Sinking
Dual Flat No-Lead (DFN) Package
- Near Chip-Scale Package Footprint; Improves PCB
Efficiency and Thinner in Profile
Pb-Free (RoHS Compliant)
Applications
Optimized for POL DC/DC Converters for IBA Systems
Core Regulators for Intel
®
and AMD
®
Microprocessors
High Current DC/DC Converters
High Frequency and High Efficiency VRM and VRD
Related Literature
Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
Technical Brief TB417 for Power Train Design, Layout
Guidelines, and Feedback Compensation Design
Data Sheet May 1, 2012
N
O
T
R
E
C
O
M
M
E
N
D
E
D
F
O
R
N
E
W
D
E
S
I
G
N
S
R
E
C
O
M
M
E
N
D
E
D
R
E
P
L
A
C
E
M
E
N
T
P
A
R
T
S
I
S
L
6
6
2
2
A
,
I
S
L
6
6
2
2
B
2
FN9205.4
May 1, 2012
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP.
RANGE (°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL6612BCBZ 6612 BCBZ 0 to +85 8 Ld SOIC M8.15
ISL6612BCRZ 12BZ 0 to +85 10 Ld 3x3 DFN L10.3x3
ISL6612BECBZ 6612 BECBZ 0
to +85 8 Ld EPSOIC M8.15B
ISL6612BEIBZ 6612 BEIBZ -40°C to +85°C 8 Ld EPSOIC M8.15B
ISL6612BIBZ 6612 BIBZ -40°C to +85°C 8 Ld SOIC M8.15
ISL6612BIRZ 2BIZ -40°C to +85°C 10 Ld 3x3 DFN L10.3x3
ISL6613BCBZ 6613 BCBZ 0 to +85 8 Ld SOIC M8.15
ISL6613BCRZ 13BZ 0 to +85 10 Ld 3x3 DFN L10.3x3
ISL6613BECBZ 6613 BECBZ 0 to +85 8 Ld EPSOIC M8.15B
ISL6613BEIBZ 6613 BEIBZ -40°C to +85°C 8 Ld EPSOIC M8.15B
ISL6613BIBZ 6613 BIBZ -40°C to +85°C 8 Ld SOIC M8.15
ISL6613BIRZ 3BIZ -40°C to +85°C 10 Ld 3x3 DFN L10.3x3
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-
020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL6612B, ISL6613B
. For more information on MSL, please see
Technical Brief TB363
.
Pinouts
ISL6612BCB, ISL6613BCB, ISL6612BECB, ISL6613BECB
(8 LD SOIC, EPSOIC)
TOP VIEW
ISL6612BCR, ISL6613BCR
(10 LD 3x3 DFN)
TOP VIEW
UGATE
BOOT
PWM
GND
1
2
3
4
8
7
6
5
PHASE
PVCC
VCC
LGATE
GND
1
UGATE
BOOT
N/C
PWM
PHASE
PVCC
N/C
VCC
2
3
4
5
GND
10
9
8
7
6
LGATE
GND
ISL6612B, ISL6613B
3
FN9205.4
May 1, 2012
Block Diagram
ISL6612B AND ISL6613B
PVCC
VCC
PWM
+5V
10K
8K
BOOT
UGATE
PHASE
LGATE
GND
FOR DFN AND EPSOIC-DEVICES, THE PAD ON THE BOTTOM SIDE OF
PAD
THE PACKAGE MUST BE SOLDERED TO THE CIRCUIT’S GROUND.
UVCC = VCC FOR ISL6612B
CONTROL
LOGIC
POR/
SHOOT-
THROUGH
PROTECTION
PRE-POR OVP
(LVCC)
UVCC = PVCC FOR ISL6613B
UVCC
FEATURES
ISL6612B, ISL6613B

ISL6612BECBZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers SYNCH BUCK MSFT HV DRVR 8LD EP LW POR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union