NZQA5V6AXV5T1

© Semiconductor Components Industries, LLC, 2009
November, 2017 Rev. 8
1 Publication Order Number:
NZQA5V6AXV5/D
NZQA5V6AXV5 Series
ESD Protection Diode
Low Clamping Voltage
This integrated surge protection device is designed for applications
requiring transient overvoltage protection. It is intended for use in
sensitive equipment such as computers, printers, business machines,
communication systems, medical equipment, and other applications.
Its integrated design provides very effective and reliable protection for
four separate lines using only one package. These devices are ideal for
situations where board space is at a premium.
Features
Low Clamping Voltage
Small SOT553 SMT Package
Stand Off Voltage: 3 V
Low Leakage Current
Four Separate Unidirectional Configurations for Protection
ESD Protection: IEC6100042: Level 4 ESD Protection
MILSTD 883C Method 30156: Class 3
Complies to USB 1.1 Low Speed & Full Speed Specifications
These are PbFree Devices
Benefits
Provides Protection for ESD Industry Standards: IEC 61000, HBM
Protects Four Lines Against Transient Voltage Conditions
Minimize Power Consumption of the System
Minimize PCB Board Space
Typical Applications
Instrumentation Equipment
Serial and Parallel Ports
Microprocessor Based Equipment
Notebooks, Desktops, Servers
Cellular and Portable Equipment
MAXIMUM RATINGS (T
A
= 25°C unless otherwise noted)
Characteristic
Symbol Value Unit
Peak Power Dissipation (Note 1) P
PK
20 W
Steady State Power 1 Diode (Note 2) P
D
380 mW
Thermal Resistance,
JunctiontoAmbient
Above 25°C, Derate
R
q
JA
327
3.05
°C/W
mW/°C
Maximum Junction Temperature T
Jmax
150 °C
Operating Junction and Storage
Temperature Range
T
J
T
stg
55 to +150 °C
Lead Solder Temperature (10 seconds
duration)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current per Figure 5.
2. Only 1 diode under power. For all 4 diodes under power, P
D
will be 25%.
Mounted on FR4 board with min pad.
See Application Note AND8308/D for further description of
survivability specs.
SOT553*
SOT553
CASE 463B
PLASTIC
5
4
1
2
3
MARKING DIAGRAM
www.onsemi.com
Device Package Shipping
ORDERING INFORMATION
NZQA5V6AXV5T1 SOT553* 4000/Tape & Reel
NZQA6V8AXV5T1 SOT553* 4000/Tape & Reel
NZQA6V8AXV5T3 16000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
xx M G
G
xx = Device Code
M = Date Code*
G = PbFree Package
(Note: Microdot may be in either location)
SOT553*
NZQA5V6AXV5T1G SOT553* 4000/Tape & Reel
NZQA6V8AXV5T1G SOT553* 4000/Tape & Reel
NZQA6V8AXV5T3G 16000/Tape & Reel
*This package is inherently PbFree.
SCALE 4:1
NZQA5V6AXV5 Series
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Symbol
Parameter
I
PP
Maximum Reverse Peak Pulse Current
V
C
Clamping Voltage @ I
PP
V
RWM
Working Peak Reverse Voltage
I
R
Maximum Reverse Leakage Current @ V
RWM
V
BR
Breakdown Voltage @ I
T
I
T
Test Current
QV
BR
Maximum Temperature Coefficient of V
BR
I
F
Forward Current
V
F
Forward Voltage @ I
F
Z
ZT
Maximum Zener Impedance @ I
ZT
I
ZK
Reverse Current
Z
ZK
Maximum Zener Impedance @ I
ZK
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
UniDirectional
I
PP
I
F
V
I
I
R
I
T
V
RWM
V
C
V
BR
V
F
ELECTRICAL CHARACTERISTICS (T
A
= 25°C)
Device
Device
Marking
Breakdown
Voltage
V
BR
@ 1 mA (V)
Leakage
Current
I
RM
@ V
RM
V
C
Max @ I
PP
(Note 4)
Typ
Capacitance
@ 0 V Bias
(pF)
(Note 3)
Typ
Capacitance
@ 3 V Bias
(pF)
(Note 3)
V
C
Min Nom Max V
RWM
I
RWM
(mA)
V
C
(V)
I
PP
(A)
Typ Max Typ Max
Per
IEC6100042
(Note 5)
NZQA5V6AXV5 5P 5.3 5.6 5.9 3.0 1.0 13 1.6 13 17 7.0 11.5 Figures 1 and 2
(See Below)
NZQA6V8AXV5 6H 6.47 6.8 7.14 4.3 1.0 13 1.6 12 15 6.7 9.5
3. Capacitance of one diode at f = 1 MHz, V
R
= 0 V, T
A
= 25°C
4. Surge current waveform per Figure 5.
5. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC6100042
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC6100042
NZQA5V6AXV5 Series
www.onsemi.com
3
IEC 6100042 Spec.
Level
Test Volt-
age (kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1 2 7.5 4 2
2 4 15 8 4
3 6 22.5 12 6
4 8 30 16 8
I
peak
90%
10%
IEC6100042 Waveform
100%
I @ 30 ns
I @ 60 ns
t
P
= 0.7 ns to 1 ns
Figure 3. IEC6100042 Spec
Figure 4. Diagram of ESD Test Setup
50 W
Cable
Device
Under
Test
Oscilloscope
ESD Gun
50 W
The following is taken from Application Note
AND8308/D Interpretation of Datasheet Parameters
for ESD Devices.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC6100042 waveform. Since the
IEC6100042 was written as a pass/fail spec for larger
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
Figure 5. 8 x 20 ms Pulse Waveform
100
90
80
70
60
50
40
30
20
10
0
020406080
t, TIME (ms)
% OF PEAK PULSE CURRENT
t
P
t
r
PULSE WIDTH (t
P
) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE I
RSM
@ 8 ms
HALF VALUE I
RSM
/2 @ 20 ms

NZQA5V6AXV5T1

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
ESD Suppressors / TVS Diodes Low Cap. TVS Quad
Lifecycle:
New from this manufacturer.
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