© Semiconductor Components Industries, LLC, 2009
November, 2017 − Rev. 8
1 Publication Order Number:
NZQA5V6AXV5/D
NZQA5V6AXV5 Series
ESD Protection Diode
Low Clamping Voltage
This integrated surge protection device is designed for applications
requiring transient overvoltage protection. It is intended for use in
sensitive equipment such as computers, printers, business machines,
communication systems, medical equipment, and other applications.
Its integrated design provides very effective and reliable protection for
four separate lines using only one package. These devices are ideal for
situations where board space is at a premium.
Features
• Low Clamping Voltage
• Small SOT−553 SMT Package
• Stand Off Voltage: 3 V
• Low Leakage Current
• Four Separate Unidirectional Configurations for Protection
• ESD Protection: IEC61000−4−2: Level 4 ESD Protection
MILSTD 883C − Method 3015−6: Class 3
• Complies to USB 1.1 Low Speed & Full Speed Specifications
• These are Pb−Free Devices
Benefits
• Provides Protection for ESD Industry Standards: IEC 61000, HBM
• Protects Four Lines Against Transient Voltage Conditions
• Minimize Power Consumption of the System
• Minimize PCB Board Space
Typical Applications
• Instrumentation Equipment
• Serial and Parallel Ports
• Microprocessor Based Equipment
• Notebooks, Desktops, Servers
• Cellular and Portable Equipment
MAXIMUM RATINGS (T
A
= 25°C unless otherwise noted)
Characteristic
Symbol Value Unit
Peak Power Dissipation (Note 1) P
PK
20 W
Steady State Power − 1 Diode (Note 2) P
D
380 mW
Thermal Resistance,
Junction−to−Ambient
Above 25°C, Derate
R
q
JA
327
3.05
°C/W
mW/°C
Maximum Junction Temperature T
Jmax
150 °C
Operating Junction and Storage
Temperature Range
T
J
T
stg
−55 to +150 °C
Lead Solder Temperature (10 seconds
duration)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Non−repetitive current per Figure 5.
2. Only 1 diode under power. For all 4 diodes under power, P
D
will be 25%.
Mounted on FR−4 board with min pad.
See Application Note AND8308/D for further description of
survivability specs.
SOT−553*
SOT−553
CASE 463B
PLASTIC
5
4
1
2
3
MARKING DIAGRAM
www.onsemi.com
Device Package Shipping
†
ORDERING INFORMATION
NZQA5V6AXV5T1 SOT−553* 4000/Tape & Reel
NZQA6V8AXV5T1 SOT−553* 4000/Tape & Reel
NZQA6V8AXV5T3 16000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
xx M G
G
xx = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
SOT−553*
NZQA5V6AXV5T1G SOT−553* 4000/Tape & Reel
NZQA6V8AXV5T1G SOT−553* 4000/Tape & Reel
NZQA6V8AXV5T3G 16000/Tape & Reel
*This package is inherently Pb−Free.
SCALE 4:1