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MC74LCX138DR2G

P1-P3P4-P6P7-P7
MC74LCX138
http://onsemi.com
4
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Units
V
CC
Supply Voltage Operating Data Retention Only 2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
V
I
Input Voltage 0 5.5 V
V
O
Output Voltage (HIGH or LOW State) (3−State) 0 V
CC
V
I
OH
HIGH Level Output Current V
CC
= 3.0 V − 3.6 V
V
CC
= 2.7 V − 3.0 V
V
CC
= 2.3 V − 2.7 V
−24
−12
−8
mA
I
OL
LOW Level Output Voltage V
CC
= 3.0 V − 3.6 V
V
CC
= 2.7 V − 3.0 V
V
CC
= 2.3 V − 2.7 V
+24
+12
+8
mA
T
A
Operating Free−Air Temperature −40 +85 C
Dt/DV
Input Transition Rise or Fall Rate, V
IN
from 0.8 V to 2.0 V, V
CC
= 3.0 V 0 10 ns/V
DC ELECTRICAL CHARACTERISTICS
T
A
= −40C to +85C
Symbol Characteristic Condition Min Max Units
V
IH
HIGH Level Input Voltage (Note 2) 2.3 V V
CC
2.7 V 1.7 V
2.7 V V
CC
3.6 V 2.0
V
IL
LOW Level Input Voltage (Note 2) 2.3 V V
CC
2.7 V 0.7 V
2.7 V V
CC
3.6 V 0.8
V
OH
HIGH Level Output Voltage
2.3 V V
CC
3.6 V; I
OH
= −100 mA
V
CC
− 0.2 V
V
CC
= 2.3 V; I
OH
= −8 mA 1.8
V
CC
= 2.7 V; I
OH
= −12 mA 2.2
V
CC
= 3.0 V; I
OH
= −18 mA 2.4
V
CC
= 3.0 V; I
OH
= −24 mA 2.2
V
OL
LOW Level Output Voltage
2.3 V V
CC
3.6 V; I
OL
= 100 mA
0.2 V
V
CC
= 2.3 V; I
OL
= 8 mA 0.6
V
CC
= 2.7 V; I
OL
= 12 mA 0.4
V
CC
= 3.0 V; I
OL
= 16 mA 0.4
V
CC
= 3.0 V; I
OL
= 24 mA 0.55
I
OFF
Power Off Leakage Current V
CC
= 0, V
IN
= 5.5 V or V
OUT
= 5.5 V 10
mA
I
IN
Input Leakage Current V
CC
= 3.6 V, V
IN
= 5.5 V or GND 5
mA
I
CC
Quiescent Supply Current V
CC
= 3.6 V, V
IN
= 5.5 V or GND 10
mA
DI
CC
Increase in I
CC
per Input 2.3 V
CC
3.6 V; V
IH
= V
CC
− 0.6 V 500
mA
2. These values of V
I
are used to test DC electrical characteristics only.
AC CHARACTERISTICS (t
R
= t
F
= 2.5 ns; R
L
= 500 W)
Limits
T
A
= −40C to +85C
V
CC
= 3.3 V 0.3 V V
CC
= 2.7 V V
CC
= 2.5 V 0.2 V
C
L
= 50 pF C
L
= 50 pF C
L
= 30 pF
Symbol Parameter Waveform Min Max Min Max Min Max Units
t
PLH
t
PHL
Propagation Delay
An to On
1, 2 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
t
PLH
t
PHL
Propagation Delay
E1, E2 to On
2 1.5
1.5
6.5
6.5
1.5
1.5
7.5
7.5
1.5
1.5
8.4
8.4
ns
t
PLH
t
PHL
Propagation Delay
E3 to On
1 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
t
OSHL
t
OSLH
Output−to−Output Skew
(Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
MC74LCX138
http://onsemi.com
5
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
C
IN
Input Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
7 pF
C
OUT
Output Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
25 pF
V
CC
0 V
V
OH
V
OL
An, E3
O
n
t
PLH
t
PHL
Vmi
Vmo
Vmo
Vmi
WAVEFORM 2: PROPAGATION DELAYS FOR NON−INVERTING OUTPUTS
2.7 V
0 V
V
OH
V
OL
An, E1, E2
On
t
PLH
t
PHL
WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING OUTPUTS
Vmi
Vmo
Vmo
Vmi
Vcc
Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V
Vmi 1.5 V 1.5 V Vcc/2
Vmo 1.5 V 1.5 V Vcc/2
Figure 4. AC Waveforms
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
C
L
Figure 5. Test Circuit
C
L
= 50 pF at V
CC
= 3.3 0.3 V or equivalent (includes jig and probe capacitance)
C
L
= 30 pF at V
CC
= 2.5 0.2 V or equivalent (includes jig and probe capacitance)
R
L
= R
1
= 500 W or equivalent
R
T
= Z
OUT
of pulse generator (typically 50 W)
MC74LCX138
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P7

MC74LCX138DR2G

Mfr. #:
Buy MC74LCX138DR2G
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers 2-3.6V CMOS 3 to 8 Decoder
Lifecycle:
New from this manufacturer.
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