MAX16805/MAX16806
EEPROM-Programmable, High-Voltage, 350mA
LED Drivers with LED Current Foldback
8 _______________________________________________________________________________________
Pin Description
PIN
MAX16805 MAX16806
NAME FUNCTION
1, 20 1, 20 OUT Current Regulated Output. Connect pins 1 and 20.
2, 3 2, 3 IN
Input Supply. Bypass IN with a 0.1µF (min) capacitor to GND. Connect pins 2
and 3.
4 4 CFD
LED Current Foldback Dimming Enable Input. Leave CFD unconnected to
enable the current foldback dimming function. Drive CFD low to disable the LED
current foldback dimming function.
5 5 DGND Digital Ground. Connect to GND.
6 — SCL I
2
C Serial Clock Input
7 — SDA I
2
C Serial-Data Input/Output
8, 10, 16 8, 10,16 GND Ground
9, 11, 18 9, 18 N.C. No Connection. Leave unconnected (internal connection).
12, 15 12, 15 V5
5V Regulated Output. Connect a 0.1µF capacitor from V5 to GND. Connect pin
12 to 15.
13 13 CS+
Positive Input of the Internal Differential Amplifier. Connect the current-sense
resistor between CS+ and CS- to program the output current level.
14 14 CS-
Negative Input of the Internal Differential Amplifier. Connect the current-sense
resistor between CS- and CS+ to program the output current level.
17 17 DIM Dimming Input. See the Dimming Input (DIM) section.
19 19 EN Enable Input. Drive EN high to enable the output and the 5V regulator.
— 11 SW Momentary Switch Interface. See the Momentary Switch Interface (SW) section.
— 6 TFP/SCL
Thermal Foldback Positive Input/I
2
C Serial Clock Input. See the Thermal Sensor
Inputs/I
2
C Interface (TFP/SCL and TFN/SDA) section.
— 7 TFN/SDA
Thermal Foldback Negative Input/I
2
C Serial-Data Input/Output. See the Thermal
Sensor Inputs/I
2
C Interface (TFP/SCL and TFN/SDA) section.
EP EP EP
Exposed Pad. Connect to the ground plane for improved power dissipation. Do
not use as a ground connection for the part.
