2003 Oct 15 3
NXP Semiconductors Product data sheet
PNP/PNP resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
PEMB3; PUMB3
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PEMB3 − plastic surface mounted package; 6 leads SOT666
PUMB3 − plastic surface mounted package; 6 leads SOT363
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor
V
CBO
collector-base voltage open emitter − −50 V
V
CEO
collector-emitter voltage open base − −50 V
V
EBO
emitter-base voltage open collector − −5 V
I
O
output current (DC) − −100 mA
I
CM
peak collector current − −100 mA
P
tot
total power dissipation T
amb
≤ 25 °C
SOT363 note 1 − 200 mW
SOT666 notes 1 and 2 − 200 mW
T
stg
storage temperature −65 +150 °C
T
j
junction temperature − 150 °C
T
amb
operating ambient temperature −65 +150 °C
Per device
P
tot
total power dissipation T
amb
≤ 25 °C
SOT363 note 1 − 300 mW
SOT666 notes 1 and 2 − 300 mW