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The typical range of values for I
L
is (0.2 I
OUT(MAX)
) to
(0.5 I
OUT(MAX)
), where I
OUT(MAX)
is the maximum load
current of the supply. Using I
L
= 0.3 I
OUT(MAX)
yields a
good design compromise between inductor performance
versus inductor size and cost. A value of I
L
= 0.3 I
OUT(MAX)
produces a ±15% of I
OUT(MAX)
ripple current around the DC
output current of the supply. Lower values of I
L
require
larger and more costly magnetics. Higher values of I
L
will increase the peak currents, requiring more filtering
on the input and output of the supply. If I
L
is too high,
the slope compensation circuit is ineffective and current
mode instability may occur at duty cycles greater than
50%. To satisfy slope compensation requirements the
minimum inductance is calculated as follows:
L > V
OUT
2DC
MAX
1
DC
MAX
R
SENSE
8.33
f
SW
Some magnetics vendors specify a volt-second product
in their data sheet. If they do not, consult the magnetics
vendor to make sure the specification is not being exceeded
by your design. The volt-second product is calculated as
follows:
Volt-second (µs) =
(V
IN(MAX)
V
OUT
) V
OUT
V
IN(MAX)
f
SW
The magnetics vendors specify either the saturation cur-
rent, the RMS current or both. When selecting an inductor
based on inductor saturation current, use the peak cur-
rent through the inductor, I
OUT(MAX)
+ I
L
/2. The inductor
saturation current specification is the current at which
the inductance, measured at zero current, decreases by
a specified amount, typically 30%.
When selecting an inductor based on RMS current rating,
use the average current through the inductor, I
OUT(MAX)
.
The RMS current specification is the RMS current at which
the part has a specific temperature rise, typically 40°C,
above 25°C ambient.
After calculating the minimum inductance value, the
volt-second product, the saturation current and the RMS
current for your design, select an off-the-shelf inductor.
Contact the Application group at Linear Technology for
further support.
For more detailed information on selecting an inductor,
please see the Inductor Selection section of Linear
Technology Application Note 44.
Step-Down Converter: MOSFET Selection
The selection criteria of the external N-channel standard
level power MOSFET include on resistance(R
DS(ON)
), re-
verse transfer capacitance (C
RSS
), maximum drain source
voltage (V
DSS
), total gate charge (Q
G
) and maximum
continuous drain current.
For maximum efficiency, minimize R
DS(ON)
and C
RSS
.
Low R
DS(ON)
minimizes conduction losses while low C
RSS
minimizes transition losses. The problem is that R
DS(ON)
is
inversely related to C
RSS
. Balancing the transition losses
with the conduction losses is a good idea in sizing the
MOSFET. Select the MOSFET to balance the two losses.
Calculate the maximum conduction losses of the MOSFET:
P
COND
= (I
OUT(MAX)
)
2
V
OUT
V
IN
(R
DS(ON)
)
Note that R
DS(ON)
has a large positive temperature depen-
dence. The MOSFET manufacturers data sheet contains
a curve, R
DS(ON)
vs Temperature.
Calculate the maximum transition losses:
P
TRAN
= (k)(V
IN
)
2
(I
OUT(MAX)
)(C
RSS
)(f
SW
)
where k is a constant inversely related to the gate driver
current, approximated by k = 2 for LT3844 applications.
The total maximum power dissipation of the MOSFET is
the sum of these two loss terms:
P
FET(TOTAL)
= P
COND
+ P
TRAN
To achieve high supply efficiency, keep the P
FET(TOTAL)
to
less than 3% of the total output power. Also, complete
a thermal analysis to ensure that the MOSFET junction
temperature is not exceeded.
T
J
= T
A
+ P
FET(TOTAL)
θ
JA
where θ
JA
is the package thermal resistance and T
A
is the
ambient temperature. Keep the calculated T
J
below the
maximum specified junction temperature, typically 150°C.
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Note that when V
IN
is high and f
SW
is high, the transition
losses may dominate. A MOSFET with higher R
DS(ON)
and lower C
RSS
may provide higher efficiency. MOSFETs
with higher voltage V
DSS
specification usually have higher
R
DS(ON)
and lower C
RSS
.
Choose the MOSFET V
DSS
specification to exceed the
maximum voltage across the drain to the source of the
MOSFET, which is V
IN(MAX)
plus any additional ringing
on the switch node. Ringing on the switch node can be
greatly reduced with good PCB layout and, if necessary,
an RC snubber.
The internal V
CC
regulator is capable of sourcing up to
40mA which limits the maximum total MOSFET gate
charge, Q
G
, to 40mA/f
SW
. The Q
G
vs V
GS
specification is
typically provided in the MOSFET data sheet. Use Q
G
at
V
GS
of 8V. If V
CC
is back driven from an external supply,
the MOSFET drive current is not sourced from the internal
regulator of the LT3844 and the Q
G
of the MOSFET is not
limited by the IC. However, note that the MOSFET drive
current is supplied by the internal regulator when the
external supply back driving V
CC
is not available such as
during start-up or short-circuit.
The manufacturers maximum continuous drain current
specification should exceed the peak switch current,
I
OUT(MAX)
+ I
L
/2.
During the supply start-up, the gate drive levels are set by
the V
CC
voltage regulator, which is approximately 8V. Once
the supply is up and running, the V
CC
can be back driven
by an auxiliary supply such as V
OUT
. It is important not to
exceed the manufacturers maximum V
GS
specification.
A standard level threshold MOSFET typically has a V
GS
maximum of 20V.
Step-Down Converter: Rectifier Selection
The rectifier diode (D1 on the Functional Diagram) in a
buck converter generates a current path for the inductor
current when the main power switch is turned off. The
rectifier is selected based upon the forward voltage, re
-
verse voltage and maximum current. A Schottky diode is
recommended. Its low forward voltage yields the lowest
power loss and highest efficiency
. The maximum reverse
voltage that the diode will see is V
IN(MAX)
.
In continuous mode operation, the average diode cur-
rent is calculated at maximum output load current and
maximum V
IN
:
I
DIODE(AVG)
=I
OUT(MAX)
V
IN(MAX)
V
OUT
V
IN(MAX)
To improve efficiency and to provide adequate margin
for short-circuit operation, a diode rated at 1.5 to 2
times the maximum average diode current, I
DIODE(AVG)
,
is recommended.
Step-Down Converter: Input Capacitor Selection
A local input bypass capacitor is required for buck convert-
ers because the input current is pulsed with fast rise and
fall
times.
The input capacitor selection criteria are based
on the bulk capacitance and RMS current capability. The
bulk capacitance will determine the supply input ripple
voltage. The RMS current capability is used to keep from
overheating the capacitor.
The bulk capacitance is calculated based on maximum
input ripple, V
IN
:
C
IN(BULK)
=
I
OUT(MAX)
V
OUT
V
IN
f
SW
V
IN(MIN)
V
IN
is typically chosen at a level acceptable to the user.
100mV to 200mV is a good starting point. Aluminum elec-
trolytic capacitors are a good choice for high voltage, bulk
capacitance due to their high capacitance per unit area.
The capacitor
’s RMS current is:
I
CIN(RMS)
=I
OUT
V
OUT
(V
IN
V
OUT
)
(V
IN
)
2
If applicable, calculate it at the worst-case condition,
V
IN
= 2V
OUT
. The RMS current rating of the capacitor
is specified by the manufacturer and should exceed the
calculated I
CIN(RMS)
. Due to their low ESR (equivalent
series resistance), ceramic capacitors are a good choice
for high voltage, high RMS current handling. Note that the
ripple current ratings from aluminum electrolytic capacitor
manufacturers are based on 2000 hours of life. This makes
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it advisable to further derate the capacitor or to choose
a capacitor rated at a higher temperature than required.
The combination of aluminum electrolytic capacitors and
ceramic capacitors is an economical approach to meet
-
ing the input capacitor requirements. The capacitor volt-
age rating must be rated greater than V
IN(MAX)
. Multiple
capacitors may also be paralleled to meet size or height
requirements in the design. Locate the capacitor very close
to the MOSFET switch and use short, wide PCB traces to
minimize parasitic inductance.
Step-Down Converter: Output Capacitor Selection
The output capacitance, C
OUT
, selection is based on the
design’s output voltage ripple, V
OUT
and transient load
requirements. V
OUT
is a function of I
L
and the C
OUT
ESR. It is calculated by:
V
OUT
= I
L
ESR+
1
(8 f
SW
C
OUT
)
The maximum ESR required to meet a V
OUT
design
requirement can be calculated by:
ESR(MAX) =
(
V
OUT
)(L)(f
SW
)
V
OUT
1
V
OUT
V
IN(MAX)
Worst-case V
OUT
occurs at highest input voltage. Use
paralleled multiple capacitors to meet the ESR require-
ments. Increasing the inductance is an option to lower
the ESR requirements. For extremely low
V
OUT
, an ad-
ditional LC filter stage can be added to the output of the
supply.
Application Note 44 has some good tips on sizing
an additional output filter.
Output Voltage Programming
A resistive divider sets the DC output voltage according
to the following formula:
R2 = R1
V
OUT
1.231V
1
The external resistor divider is connected to the output
of the converter as shown in Figure 2. Tolerance of the
feedback resistors will add additional error to the output
voltage.
Example: V
OUT
= 12V; R1 = 10k
R2 = 10k
12V
1.231V
1
= 87.48k use 86.6k 1%
The V
FB
pin input bias current is typically 25nA, so use
of extremely high value feedback resistors could cause a
converter output that is slightly higher than expected. Bias
current error at the output can be estimated as:
V
OUT(BIAS)
= 25nA R2
Supply UVLO and Shutdown
The SHDN pin has a precision voltage threshold with
hysteresis which can be used as an undervoltage lockout
threshold (UVLO) for the power supply. Undervoltage
lockout keeps the LT3844 in shutdown until the supply
input voltage is above a certain voltage programmed by
the user. The hysteresis voltage prevents noise from falsely
tripping UVLO.
Resistors are chosen by first selecting R
B
. Then:
R
A
= R
B
V
SUPPLY(ON)
1.35V
1
L1
V
FB
PIN
R2
R1
V
OUT
C
OUT
3844 F02
SHDN PIN
R
A
R
B
V
SUPPLY
3844 F03
Figure 2. Output Voltage Feedback Divider Figure 3. Undervoltage Lockout Circuit

LT3844IFE#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 60V DC/DC Controller w/ PLL
Lifecycle:
New from this manufacturer.
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