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Para. Test Items Requirements Procedures
Environmental Performance Requirements
3.8.3 (1) Vibration Sinusoidal
Low Frequency
No electrical discontinuity greater
than 1 microsecond shall occur.
Termination resistance (low level)
shall be met
Subject mated connectors to 10-55-10 Hz
traversed in 1 minute at 1.52 mm
amplitude 2 hours each of 3 mutually
perpendicular planes
MIL-STD-202, Method 201,
Condition A
3.8.3 (2) Physical Shock No electrical discontinuity greater
than 1 microsecond shall occur.
Termination resistance (low level)
shall be met.
Subject mated connectors to 490.3 m/s
2
halfsine shock pulses of 11milisecond
duration; 3 shocks in each direction
applied along the 3 mutually perpendicular
planes total 18 shocks.
MIL-STD-202, Method 213
Condition A
3.8.3 (3) Temperature Life Termination resistance (low level)
shall be met.
Subject mated connectors to temperature
life; testing atmosphere at 85±2
o
C for 96
hours
3.8.3 (4) Resistance to Cold Termination resistance (low level)
shall be met
Subject mated connectors to cold testing
atmosphere at -25±3
o
C for 48 hours.
Subsequent measurement shall be done
after reconditioning in the room
temperature for 1 hour.
3.8.3 (5) Humidity, Steady State
Insulation resistance (Final)
500 M min.
Termination resistance
(low level) shall be met.
Subject mated connectors to steady state
humidity at 40
o
C and
90-95 % (R.H.)
MIL-STD-202, Method 103
Condition B
3.8.3 (6) Thermal Shock Termination resistance (low level)
shall be met
Subject mated connectors to 5 cycles
between –55
o
C and 85
o
C for 30 minutes
each duration at temperature extremes.
MIL-STD-202, Method 107
Condition A
3.8.3 (7) Salt Spray Resistance (low level) (Final)
must meet visual & electrical
requirements, which applicable
Subject mated/unmated connectors to 5%
salt concentration for 48 hours
MIL-STD-202, Method 101
Condition B
3.8.3 (8) Sulfurous Acid Gas Termination resistance (low level)
shall be met.
Subject mated connectors to sulfurous acid
gas atmosphere of 3±1 ppm concentration
at 40±2
o
C for 240 hours. Subsequent
measurement shall be done after
reconditioning in the room temperature for
1 hour.
3.8.3 (9) Solderability Solderable area shall have a
solder coverage of 95% minimum
Subject contacts to soderability testing, as
specified.
MIL-STD-202, Method 208
Fig. 2 (To be continued)
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Para. Test Items Requirements Procedures
3.8.3 (10)
Resistance to Soldering
Heat
No physical damage shall be
evident after testing
Subject product mounted on printed circuit
boards to solder bath at 245±5
o
C for 10±1
seconds
MIL-STD-202, Method 210 except as
indicated above when testing by manual
soldering iron, apply it as 350±10oC for 3
seconds without forcing pressure to affect
the tine of contact.
SMT product mounted on printed circuit
boards to solder reflow as like Fig. 7.
(Measured at housing surface)
3.8.3 (11)
Sequence Testing The requirements for the each
testing level shall be met.
See Para. 3.8.3 (11-1) and
Para. 3.8.3 (11-2)
3.8.3
(11-1)
Connector Repeated
Mating/Unmating
After testing, terminator resistance
(low level) shall be met.
Subject connector assembly to 30 cycles of
repeated mating/unmating at a rate of 10
cycles a minute
3.8.3
(11-2)
Temperature Humidity
Cycling
After testing, termination
resistance (low level) shall be met
Subject mated connector to temperature changes
between 25
o
C and 65
o
C with 95 %(R.H.) for 5
cycles.
JIS C 0028
Fig. 2 (End)
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Fig.3
Fig.4
Fig.5 Fig.6
(Measured at housing surface)
Fig.7

6-292161-8

Mfr. #:
Manufacturer:
TE Connectivity
Description:
Headers & Wire Housings CT P/HDR ASSY V 8P W/KINK BLAC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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