Spec No.JELF243A-0052R-01 P.3/9
MURATA MFG.CO.,LTD
Reference
Only
No. Item Specification Test Method
7.2 Bending Test Chip coil shall not be damaged after
tested as test method.
Substrate:Glass-epoxy substrate
(100mm×40mm×1.6mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:30 s
7.3 Vibration Oscillation Frequency :
10Hz ~ 55Hz ~ 10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:A period of 2 hours in each of
3 mutually perpendicular
directions. (Total 6h)
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
7.5 Resistance to
Soldering Heat
Appearance : No damage
Inductance Change : within ± 5%
Flux:Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
(It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance : No damage
Inductance Change : within ±5%
Q Change : within ±20%
Temperature:85°C±2°C
Time:1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24h±2h.
8.2 Cold Resistance Temperature:-40°C±2°C
Time:1000h (+48h ,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.3 Humidity Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle
1 cycle :
1 step : -40°C±2°C / 30 min ± 3 min
2 step : Ordinary temp. / 10 min to 15 min
3 step : +85°C±2°C / 30 min ± 3 min
4 step : Ordinary temp. / 10 min to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
45
R340
F
Deflection
45
Product
Pressure jig
(in mm)