GTL2002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 8 — 19 August 2013 22 of 27
NXP Semiconductors
GTL2002
2-bit bidirectional low voltage translator
Fig 22. PCB footprint for SOT902-2 (XQFN8); reflow soldering
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GTL2002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 8 — 19 August 2013 23 of 27
NXP Semiconductors
GTL2002
2-bit bidirectional low voltage translator
17. Abbreviations
Table 15. Abbreviations
Acronym Description
CBT Cross Bar Technology
CDM Charged-Device Model
CMOS Complementary Metal-Oxide Semiconductor
CPU Central Processing Unit
ESD ElectroStatic Discharge
GTL Gunning Transceiver Logic
HBM Human Body Model
I/O Input/Output
I
2
C-bus Inter-Integrated Circuit bus
LVTTL Low Voltage Transistor-Transistor Logic
NMOS Negative-channel Metal-Oxide Semiconductor
RC Resistor Capacitor network
TTL Transistor-Transistor Logic
TVC Transceiver Voltage Clamps
GTL2002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 8 — 19 August 2013 24 of 27
NXP Semiconductors
GTL2002
2-bit bidirectional low voltage translator
18. Revision history
Table 16. Revision history
Document ID Release date Data sheet status Change notice Supersedes
GTL2002 v.8 20130819 Product data sheet - GTL2002 v.7
Modifications:
Section 2 “Features and benefits:
10th bullet item: deleted phrase “150 V MM per JESD22-A115”
11th bullet item changed from “XQFN8U” to “XQFN8”
Table 1 “Ordering information:
removed type number “GTL2002DP/Q900”
added column “Topside marking”
GTL2002GM package name, description, and version changed per PCN #201108001F01:
from “XQFN8U, plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based;
body 1.6 1.6 0.5 mm (SOT902-1)”
to “XQFN8, plastic extremely thin quad flat package; no leads; 8 terminals;
body 1.6 1.6 0.5 mm (SOT902-2)”
Table 2 “Ordering options:
Added columns “Orderable part number”, “Package”, “Packing method”, and “Minimum order
quantity”
Column “Topside mark” is moved to Table 1
Figure 3 “Pin configuration for TSSOP8 (MSOP8) updated:
removed type number “GTL2002DP/Q900”
Figure 5 changed from “XQFN8U” (SOT902-1) to “XQFN8” (SOT902-2),
(per PCN #201108001F01)
Table 3 “Pin description modified: column heading changed from “XQFN8U” to “XQFN8”
Figure 16 changed from “SOT902-1 (XQFN8U)” to “SOT902-2 (XQFN8)”,
per PCN #201108001F01
Section 15 “Soldering of SMD packages updated
Added Section 16 “Soldering: PCB footprints
GTL2002 v.7 20090702 Product data sheet - GTL2002 v.6
GTL2002 v.6 20071221 Product data sheet - GTL2002 v.5
GTL2002 v.5 20070813 Product data sheet - GTL2002 v.4
GTL2002 v.4 20060829 Product data sheet - GTL2002 v.3
GTL2002 v.3
(9397 750 13058)
20040929 Product data sheet - GTL2002 v.2
GTL2002 v.2
(9397 750 11349)
20030401 Product data ECN 853-2214 29603
dated 2003 Feb 28
GTL2002 v.1
GTL2002 v.1
(9397 750 07417)
20000216 Product specification ECN 853-2214 24367
dated 2000 Aug 16
-

GTL2002DP/S440,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC TRNSLTR BIDIRECTIONAL 8TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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