VCNL4040
www.vishay.com
Vishay Semiconductors
Rev. 1.4, 02-Mar-15
18
Document Number: 84274
For technical questions, contact: sensorstechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RECOMMENDED INFRARED REFLOW
Soldering conditions which are based on J-STD-020 C
Recommend Normal Solder Reflow is 235 °C to 265 °C
Fig. 22 - VCNL4040 Solder Reflow Profile Chart
RECOMMENDED STORAGE AND REBAKING CONDITIONS
PARAMETER CONDITIONS MIN. MAX. UNIT
Storage temperature 5 50 °C
Relative humidity 60 %
Open time 168 h
Total time From the date code on the aluminized envelope (unopened) 12 months
Rebaking
Tape and Reel: 60 °C 22 h
Tube: 60 °C 22 h
IR REFLOW PROFILE CONDITION
PARAMETER CONDITIONS TEMPERATURE TIME
Peak temperature 260 °C + 5 °C / - 5 °C (max.: 265 °C) 10 s
Preheat temperature range and timing 150 °C to 200 °C 60 s to 180 s
Timing within 5 °C to peak temperature 10 s to 30 s
Timing maintained above temperature / time 217 °C 60 s to 150 s
Timing from 25 °C to peak temperature 8 minutes (max.)
Ramp-up rate 3 °C/s (max.)
Ramp-down rate 6 °C/s (max.)
200
150
217
260
Max. Temperature
260+5/-5
0
C / 10 seconds
Soldering Zone
60-150 seconds
Temperature (
ºC
)
Time (
second)
t
2
t
1
Ramp-up Rate
3
0
C / seconds
(max)
Ramp-down Rate
6
0
C / seconds
(max)
Ramp-up Rate
3
0
C / seconds
(max)
Pre-Heating Time
t
2
-t
1
= 60 - 180 secons
