NCP1081
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6
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min. Max. Units Conditions
VPORTP Input power supply −0.3 72 V Voltage with respect to VPORTN
1,2
RTN
ARTN
Analog ground supply 2 −0.3 72 V Pass−switch in off−state
(Voltage with respect to VPORTN
1,2
)
VDDH Internal regulator output −0.3 17 V Voltage with respect to ARTN
VDDL Internal regulator output −0.3 3.6 V Voltage with respect to ARTN
CLASS Analog output −0.3 3.6 V Voltage with respect to VPORTN
1,2
INRUSH Analog output −0.3 3.6 V Voltage with respect to VPORTN
1,2
ILIM1 Analog output −0.3 3.6 V Voltage with respect to VPORTN
1,2
UVLO Analog input −0.3 3.6 V Voltage with respect to VPORTN
1,2
OSC Analog output −0.3 3.6 V Voltage with respect to ARTN
COMP Analog input / output −0.3 3.6 V Voltage with respect to ARTN
FB Analog input −0.3 3.6 V Voltage with respect to ARTN
CS Analog input −0.3 3.6 V Voltage with respect to ARTN
SS Analog input −0.3 3.6 V Voltage with respect to ARTN
nCLASS_AT Analog output −0.3 3.6 V Voltage with respect to ARTN
TEST1
TEST2
Digital inputs −0.3 3.6 V Voltage with respect to VPORTN
1,2
Ta Ambient temperature −40 85 °C
Tj Junction temperature − 150 °C
Tj−TSD Junction temperature (Note 1) − 175 °C Thermal shutdown condition
T
stg
Storage Temperature −55 150 °C
T
θ
JA
Thermal Resistance,
Junction to Air (Note 2)
37.6 °C/W Exposed pad connected to VPORTN
1,2
ground
ESD−HBM Human Body Model 4 − kV per JEDEC Standard JESD22
ESD−CDM Charged Device Model 750 − V
ESD−MM Machine Model 300 − V
LU Latch−up ±200 − mA per JEDEC Standard JESD78
ESD−SYS System ESD (contact/air) (Note 3) 8/15 − kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tj−TSD allowed during error conditions only. It is assumed that this maximum temperature condition does not occur more than 1 hour
cumulative during the useful life for reliability reasons.
2. Mounted on a 1S2P (3 layer) test board with copper coverage of 25 percent for the signal layers and 90 percent copper coverage for the
inner planes at an ambient temperature of 85°C in still air. Refer to JEDEC JESD51−7 for details.
3. Surges per EN61000−4−2, 1999 applied between RJ−45 and output ground and between adapter input and output ground of the evaluation
board. The specified values are the test levels and not the failure levels.