Exposed-Pad Package
The exposed-pad, 20-pin, TQFN package incorporates
features that provide a very low thermal-resistance path
for heat removal from the IC. The exposed pad on the
MAX4951 must be soldered to GND for proper thermal
and electrical performance. For more information on
exposed-pad packages, refer to Maxim Application
Note HFAN-08.1:
Thermal Considerations of QFN and
Other Exposed-Paddle Packages
.
Layout
Use controlled-impedance transmission lines to inter-
face with the MAX4951 high-speed inputs and outputs.
Place power-supply decoupling capacitors as close as
possible to V
CC
.
ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The MAX4951 is protected against ESD up
to ±5.5kV (Human Body Model) without damage. The
ESD structures withstand ±5.5kV in all states: normal
operation and powered down. After an ESD event, the
MAX4951 continues to function without latchup.
MAX4951
SATA I/SATA II Bidirectional Re-Driver
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Functional Diagram/Truth Table
