NCS2220A
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9
PACKAGE DIMENSIONS
UDFN8, 1.6x1.6, 0.4P
CASE 517AC−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
K8X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
8X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
4
58
DIM MIN NOM MAX
MILLIMETERS
A 0.45 0.50 0.55
A1 0.00 0.03 0.05
A3 0.127 REF
b 0.15 0.20 0.25
D 1.60 BSC
D2 0.70 0.80 0.90
E 1.60 BSC
E2 0.40 0.50 0.60
e 0.40 BSC
K 0.20 −−− −−−
L 0.20 0.30 0.40
(A3)
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ǒ
mm
inches
Ǔ
SCALE 20:1
0.902
0.0355
0.924
0.0364
0.490
0.0193
0.400
0.0157
PITCH
0.502
0.0197
0.200
0.0079
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