NTLJF4156NT1G

© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 4
1 Publication Order Number:
NTLJF4156N/D
NTLJF4156N
Power MOSFET and
Schottky Diode
30 V, 4.6 A, mCool] N−Channel, with
2.0 A Schottky Barrier Diode, 2x2 mm
WDFN Package
Features
WDFN Package Provides Exposed Drain Pad for Excellent Thermal
Conduction
Co−Packaged MOSFET and Schottky For Easy Circuit Layout
R
DS(on)
Rated at Low V
GS(on)
Levels, V
GS
= 1.5 V
Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
Low VF Schottky
This is a Pb−Free Device
Applications
DC−DC Converters
Li−Ion Battery Applications in Cell Phones, PDAs, Media Players
Color Display and Camera Flash Regulators
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
30 V
Gate−to−Source Voltage V
GS
±8.0 V
Continuous Drain
Current (Note 1)
Steady
State
T
J
= 25°C
I
D
3.7
A
T
J
= 85°C 2.7
t 5 s T
J
= 25°C 4.6
Power Dissipation
(Note 1)
Steady
State
T
J
= 25°C
P
D
1.5
W
t 5 s 2.3
Continuous Drain
Current (Note 2)
Steady
State
T
J
= 25°C
I
D
2.5
A
T
J
= 85°C 1.8
Power Dissipation
(Note 2)
T
J
= 25°C
P
D
0.71
Pulsed Drain Current
t
p
= 10 ms
I
DM
20 A
Operating Junction and Storage Temperature T
J
, T
STG
−55 to
150
°C
Source Current (Body Diode) (Note 2) I
S
2.4 A
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm
2
, 2 oz. Cu.
1
2
3
6
5
4
A
N/C
D
K
G
S
http://onsemi.com
30 V
30 V
90 mW @ 2.5 V
70 mW @ 4.5 V
2.0 A
R
DS(on)
MAX
4.6 A
0.47 V
I
D
MAX (Note 1)V
(BR)DSS
MOSFET
SCHOTTKY DIODE
V
R
MAX I
F
MAXV
F
TYP
125 mW @ 1.8 V
250 mW @ 1.5 V
G
S
N−CHANNEL MOSFET
D
K
A
SCHOTTKY DIODE
JL = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
JLMG
G
1
2
3
6
5
4
WDFN6
CASE 506AN
MARKING
DIAGRAM
(Top View)
1
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
PIN CONNECTIONS
K
D
NTLJF4156N
http://onsemi.com
2
SCHOTTKY DIODE MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Peak Repetitive Reverse Voltage V
RRM
30 V
DC Blocking Voltage V
R
30 V
Average Rectified Forward Current I
F
2.0 A
THERMAL RESISTANCE RATINGS
Parameter Symbol Max Unit
Junction−to−Ambient – Steady State (Note 3)
R
q
JA
83
°C/W
Junction−to−Ambient – t 5 s (Note 3)
R
q
JA
54
Junction−to−Ambient – Steady State Min Pad (Note 4)
R
q
JA
180
3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
4. Surface Mounted on FR4 Board using the minimum recommended pad size of 30 mm
2
, 2 oz. Cu.
MOSFET ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Test Conditions Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
30 V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/T
J
I
D
= 250 mA, Ref to 25°C
18.1 mV/°C
Zero Gate Voltage Drain Current I
DSS
V
DS
= 24 V, V
GS
= 0 V
T
J
= 25°C 1.0 mA
T
J
= 85°C 10
Gate−to−Source Leakage Current I
GSS
V
DS
= 0 V, V
GS
= ±8.0 V 100 nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
0.4 0.7 1.0 V
Gate Threshold
Temperature Coefficient
V
GS(TH)
/T
J
2.8 mV/°C
Drain−to−Source On−Resistance R
DS(on)
V
GS
= 4.5, I
D
= 2.0 A 47 70 mW
V
GS
= 2.5, I
D
= 2.0 A 56 90
V
GS
= 1.8, I
D
= 1.8 A 88 125
V
GS
= 1.5, I
D
= 1.5 A 133 250
Forward Transconductance g
FS
V
DS
= 10 V, I
D
= 2.0 A 4.5 S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1.0 MHz,
V
DS
= 15 V
427
pF
Output Capacitance C
OSS
51
Reverse Transfer Capacitance C
RSS
32
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 15 V,
I
D
= 2.0 A
5.4 6.5
nC
Threshold Gate Charge Q
G(TH)
0.5
Gate−to−Source Charge Q
GS
0.8
Gate−to−Drain Charge Q
GD
1.24
Gate Resistance R
G
3.7
W
5. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
6. Switching characteristics are independent of operating junction temperatures.
NTLJF4156N
http://onsemi.com
3
MOSFET ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter UnitMaxTypMinTest ConditionsSymbol
SWITCHING CHARACTERISTICS (Note 6)
Turn−On Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DD
= 15 V,
I
D
= 2.0 A, R
G
= 2.0 W
4.8
ns
Rise Time t
r
9.2
Turn−Off Delay Time t
d(OFF)
14.2
Fall Time t
f
1.7
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Recovery Voltage
V
SD
V
GS
= 0 V, IS = 2.0 A
T
J
= 25°C 0.78 1.2
V
T
J
= 125°C 0.62
Reverse Recovery Time t
RR
V
GS
= 0 V, d
ISD
/d
t
= 100 A/ms,
I
S
= 2.0 A
10.5
ns
Charge Time t
a
7.6
Discharge Time t
b
2.9
Reverse Recovery Time Q
RR
5.0 nC
5. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
6. Switching characteristics are independent of operating junction temperatures.
SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter Symbol Test Conditions Min Typ Max Unit
Maximum Instantaneous
Forward Voltage
V
F
I
F
= 0.1 A 0.34 0.39
V
I
F
= 1.0 A 0.47 0.53
Maximum Instantaneous
Reverse Current
I
R
V
R
= 30 V 17 20
mA
V
R
= 20 V 3.0 8.0
V
R
= 10 A 2.0 4.5
SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T
J
= 85°C unless otherwise noted)
Parameter Symbol Test Conditions Min Typ Max Unit
Maximum Instantaneous
Forward Voltage
V
F
I
F
= 0.1 A 0.22 0.35
V
I
F
= 1.0 A 0.40 0.50
Maximum Instantaneous
Reverse Current
I
R
V
R
= 30 V 0.22 2.5
mA
V
R
= 20 V 0.11 1.6
V
R
= 10 V 0.06 1.2
SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T
J
= 125°C unless otherwise noted)
Parameter
Symbol Test Conditions Min Typ Max Unit
Maximum Instantaneous
Forward Voltage
V
F
I
F
= 0.1 A 0.2 0.29
V
I
F
= 1.0 A 0.4 0.47
Maximum Instantaneous
Reverse Current
I
R
V
R
= 30 V 2.0 20
mA
V
R
= 20 V 1.1 10.9
V
R
= 10 V 0.63 8.4
SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter Symbol Test Conditions Min Typ Max Unit
Capacitance C V
R
= 5.0 V, f = 1.0 MHz 38 pF
7. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
8. Surface−mounted on FR4 board using the minimum recommended pad size of 30 mm
2
, 2 oz cu.
9. Pulse Test: pulse width v 300 ms, duty cycle v2%.
10.Switching characteristics are independent of operating junction temperatures.

NTLJF4156NT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET 2X2 30V 4A 70MOHM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet