FDS7760A Rev D (W)
DMOS Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol
Parameter Test Conditions Min Typ
Max
Units
Drain-Source Avalanche Ratings (Note 2)
W
DSS
Single Pulse Drain-Source
Avalanche Energy
V
DD
= 15 V, I
D
= 15 A 360 mJ
I
AR
Maximum Drain-Source Avalanche
Current
15 A
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= 250 µA
30 V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250 µA, Referenced to 25°C
24
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= 24 V, V
GS
= 0 V 1
µA
I
GSSF
Gate–Body Leakage, Forward V
GS
= 20 V, V
DS
= 0 V 100 nA
I
GSSR
Gate–Body Leakage, Reverse V
GS
= –20 V V
DS
= 0 V –100 nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250 µA
1 1.6 3 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250 µA, Referenced to 25°C
-5
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= 10 V, I
D
= 15 A
V
GS
= 10 V, I
D
= 15 A, T
J
= 125°C
V
GS
= 4.5 V, I
D
= 13 A
4.5
7
6
5.5
8
8
mΩ
I
D(on)
On–State Drain Current V
GS
= 10 V, V
DS
= 5 V 50 A
g
FS
Forward Transconductance V
DS
= 10 V, I
D
= 15 A 65 S
Dynamic Characteristics
C
iss
Input Capacitance 3514 pF
C
oss
Output Capacitance 1123 pF
C
rss
Reverse Transfer Capacitance
V
DS
= 15 V, V
GS
= 0 V,
f = 1.0 MHz
307 pF
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 13 20 ns
t
r
Turn–On Rise Time 12 19 ns
t
d(off)
Turn–Off Delay Time 78 125 ns
t
f
Turn–Off Fall Time
V
DD
= 15 V, I
D
= 1 A,
V
GS
= 10 V, R
GEN
= 6 Ω
32 51 ns
Q
g
Total Gate Charge 37 55 nC
Q
gs
Gate–Source Charge 10 nC
Q
gd
Gate–Drain Charge
V
DS
= 15 V, I
D
= 15 A,
V
GS
= 5 V
12 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current 2.1 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= 2.1 A (Note 2) 0.7 1.2 V
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 50°/W when
mounted on a 1in
2
pad of 2 oz copper
b) 105°/W when
mounted on a .04 in
2
pad of 2 oz copper
c) 125°/W when mounted on a
minimum pad.
2. Test: Pulse Width < 300µs, Duty Cycle < 2.0%
