SpecNo.JELF243A-0140A-01 P.3/10
MURATA MFG.CO.,LTD
Reference Only
7.Mechanical Performance
No. Item Specification Test Method
7.1
Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(in mm)
Applied Direction:
Force:2.5N
Hold Duration:60s±1s
7.2 Bending Test Substrate:Glass-epoxy substrate
(100mm×40mm×1.0mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:5s
7.3 Vibration Chip coil shall not be damaged
after tested as test method.
Oscillation Frequency : 10 to 2000 to 10Hz
for 15 minutes.
Total amplitude: 3 mm or Acceleration
amplitude 196m/s
2
whichever is smaller.
Time : A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6hours)
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5℃
Immersion Time:3s±1s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
Substrate
F
Chip Coil
0.4
0.5
1.4
0.66
Chi
Coil
Pattern
Solder resist
Substrate
45
R230
F
Deflection
45
Product
Pressure jig
(in mm)
