MMBD4148
350mW 100 Volt
Silicon Epitaxial Diode
SOT-23
Suggested Solder
Pad Layout
Features
• Low Current Leakage
• Halogen free available upon request by adding suffix "-HF"
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .110 .120 2.80 3.04
C .047 .055 1.20 1.40
D .035 .041 .89 1.03
E .070 .081 1.78 2.05
F .018 .024 .45 .60
G .0005 .0039 .013 .100
H .035 .044 .89 1.12
J .003 .007 .085 .180
K .015 .020 .37 .51
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 357K/W Junction To Ambient
Electrical Characteristics @ 25°C Unless Otherwise Specified
Reverse Voltage V
R
75V
Peak Reverse
Voltage
V
RM
100V
Average Rectified
Current
I
O
150mA Resistive Load
f > 50Hz
Power Dissipation P
TOT
350mW
Junction
Temperature
T
J
150°C
Peak Forward Surge
Current
I
FSM
1A t=1s,Non-Repetitive
Maximum
Instantaneous
Forward Voltage
V
F
.855V I
FM
= 10mA;
T
J
= 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
I
R
25nA
T
J
= 25°C
V
R
= 20 V
Typical Junction
Capacitance
C
J
2pF Measured at
1.0MHz, V
R
=0V
Reverse Recovery
Time
T
rr
4nS I
F
=10mA
V
R
= 6V
R
L
=100Ω
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
A
B
C
D
E
F
G
H
.079
2.000
in
h
mm
.
1
.800
.035
.900
.950
.037
.950
Pin Configuration
Top View
www.mccsemi.com
omponents
20736 Marilla Street Chatsworth
!"#
$% !"#
MCC
Revision: B 2013/01/01
TM
Micro Commercial Components
1
3
2
1 of 4
Marking : KA2, A2
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Lead Free Finish/Rohs Compliant ("P"Suffix designates
RoHS Compliant. See ordering information)
B .083 .104 2.10 2.64
