TB62777FNG/FG
Package Dimensions
Weight: 0.14 g (typ.)
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TB62777FNG/FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result
in injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
event of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow. Such a
breakdown can lead to smoke or ignition. To minimize the effects of a large current flow in the event of
breakdown, fuse capacity, fusing time, insertion circuit location, and other such suitable settings are
required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
For ICs with built-in protection functions, use a stable power supply with. An unstable power supply
may cause the protection function to not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
(4)
Do not insert devices incorrectly or in the wrong orientation. Make sure that the positive and negative
terminals of power supplies are connected properly. Otherwise, the current or power consumption may
exceed the absolute maximum rating, and exceeding the rating(s) may cause breakdown, damage or
deterioration of the device, which may result in injury by explosion or combustion. In addition, do not
use any device that has had current applied to it while inserted incorrectly or in the wrong orientation
even once.
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TB62777FNG/FG
(5) Carefully select power amp, regulator, or other external components (such as inputs and negative
feedback capacitors) and load components (such as speakers).
If there is a large amount of leakage current such as input or negative feedback capacitors, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
(1) Heat Dissipation Design
In using an IC with large current flow such as a power amp, regulator or driver, please design the
device so that heat is appropriately dissipated, not to exceed the specified junction temperature (Tj) at
any time or under any condition. These ICs generate heat even during normal use. An inadequate IC
heat dissipation design can lead to decrease in IC life, deterioration of IC characteristics or IC
breakdown. In addition, please design the device taking into consideration the effect of IC heat
dissipation on peripheral components..
(2)
Back-EMF
When a motor rotates in the reverse direction, stops, or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in your
system design.
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TB62777FNG,C8,EL

Mfr. #:
Manufacturer:
Toshiba
Description:
LED Lighting Drivers 8-Channel 50mA 26V LED Driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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