Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 10405 BU-MC17041
August 2017
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of their respective owners.
Technical Data 10405
Effective August 2017
C310FH
3.1 mm x 10 mm Fast-acting, axial lead ceramic tube fuses
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Wave solder profile
Reference EN 61760-1:2006
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat • Temperature min. (T
smin
) 100°C 100°C
• Temperature typ. (T
styp
) 120°C 120°C
• Temperature max. (T
smax
) 130°C 130°C
• Time (T
smin
to T
smax
) (t
s
) 70 seconds 70 seconds
D
preheat to max Temperature
150°C max. 150°C max.
Peak temperature (T
P
)* 235°C – 260°C 250°C – 260°C
Time at peak temperature (t
p
) 10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate ~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25°C to 25°C 4 minutes 4 minutes
Manual solder
350°C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended.
Reflow solder not recommended
Temperature
Time
T
T
smax
T
styp
T
p
t
p
First Wave
Second Wave
Preheat area
Cool down area
