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LQH3NPN4R7MMEL

P1-P3P4-P6P7-P8
SpecNo.JELF243A-0153D-01 P1/8
MURATA MFG.CO., LTD
Reference Only
CHIP COIL（CHIP INDUCTORS）LQH3NPN□□□□MEL REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH3NPN_ME series, Chip coil (Chip Inductors).
2.Part Numbering
(ex) LQ H 3N P N 1R0 M M E L
Product ID
Structure
Dimension
Applications Category Inductance Tolerance Dimension
Other Packaging
(L×W)
and
(T)
L: Φ180Taping
Characteristics
3.Rating
Operating Temperature Range
(Ambient temperature; Self-temperature rise is not included) -40 to +105°C
(Product temperature; Self- temperature rise is included) -40 to +125°C
Storage Temperature Range.
-40 to +125°C
Customer
Part Number
Murata
Part Number
Inductance
DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min)
Rated Current(mA)
∗1 Based on
inductance
change
∗2 Based on
Temperature rise
(µH)
Tolerance
(%)
∗3 Ambient
temperature
(85 )℃
∗4 Ambient
temperature
(105 )℃
LQH3NPN1R0MMEL 1.0
M:±20
0.025±20% 100 2350 3000 1600
LQH3NPN2R2MMEL 2.2 0.065±20% 60 1800 2100 1220
LQH3NPN3R3MMEL 3.3 0.084±20% 55 1520 1900 1150
LQH3NPN4R7MMEL 4.7 0.10±20% 40 1300 1700 1000
LQH3NPN6R8MMEL 6.8 0.14±20% 30 1040 1450 900
LQH3NPN100MMEL 10 0.19±20% 20 810 1280 800
LQH3NPN150MMEL 15 0.29±20% 15 660 1020 620
LQH3NPN220MMEL 22 0.40±20% 10 570 860 540
LQH3NPN330MMEL 33 0.55±20% 8 440 760 460
LQH3NPN470MMEL 47 0.82±20% 5 380 610 380
LQH3NPN560MMEL 56 1.0±20% 5 350 500 320
LQH3NPN680MMEL 68 1.15±20% 5 310 470 300
LQH3NPN101MMEL 100 1.59±20% 3 260 430 270
∗1:When applied Rated current to the Products , Inductance will be within ±30% of initial inductance value range.
∗2:Keep the temperature (ambient temperature plus self-generation of heat) under 125 . ℃
∗3:When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to 40 max.℃
(Ambient temperature 85 ).℃
∗4:When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to 20 max.℃
(Ambient temperature 85 to 105 ).℃
4. Testing Conditions
<Unless otherwise specified> <In case of doubt>
Temperature
: Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C
Humidity
: Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
SpecNo.JELF243A-0153D-01 P2/8
MURATA MFG.CO., LTD
Reference Only
3.0±0.2
3.0±0.1
0.9±0.2
3.0±0.2
1R0
1.1±0.1
■Unit Mass (Typical value)
0.034g
(in mm)
0.9±0.1
0.9±0.2
3.0±0.1
3.0±0.2
3.0±0.2
0.8±0.3 0.8±0.3
1.4+/-0.1
5.Appearance and Dimensions
■Unit Mass (Typical value)
0.051g
(in mm)
6.Product Marking
Inductance Three digists : 0.47μH
→
R47
1.0μH
→
1R0
10μH
→
100
7.Electrical Performance
No. Item Specification Test Method
7.1 Inductance
Inductance shall meet item 3. Measuring Equipment: KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
7.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
7.3 Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment: KEYSIGHT E4991A or equivalent
8.Mechanical Performance
No. Item Specification Test Method
8.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate
Force: 10N
Hold Duration: 5±1s
8.2 Bending Test Substrate: Glass-epoxy substrate
(100×40×1.0mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5s
(in mm)
45
R230
F
Deflection
45
Product
Pressure jig
Ch i p
c
o il
Ｆ
S u b s
t
r
a
t
e
SpecNo.JELF243A-0153D-01 P3/8
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
8.3 Vibration Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes
Total amplitude : 1.5 mm or Acceleration amplitude
98m/s
2
whichever is smaller.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
8.4 Solderability The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
Flux:Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating:150±10°C / 60 to 90s
Solder Temperature:240±5°C
Immersion Time:3±1 s
8.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±20%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition for
24±2 hours.
9.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
9.1 Heat Resistance Appearance:No damage
Inductance Change : within ±10%
DC Resistance Change: within ± 10%
Temperature: 105±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
9.2 Cold Resistance Temperature: -40±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
9.3 Humidity Temperature: 85±2°C
Humidity: 80~85%(RH)
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
9.4 Temperature Cycle 1 cycle:
1 step: -40±2°C / 30±3 min
2 step: Ordinary temp. / 10 to 15 min
3 step: +105±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 min
Total of 100 cycles
Then measured after exposure in the room condition for
24±2 hours.
P1-P3P4-P6P7-P8

LQH3NPN4R7MMEL

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Inductor Power Chip Shielded Wirewound 4.7uH 20% 1MHz Ferrite 1.7A 120mOhm DCR 1212 T/R
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