LT3492
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PACKAGE DESCRIPTION
FE28 (EB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0o – 8o
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8910
11
12 13 14
192022 21 151618 17
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
2.74
(.108)
28 2726 25 24 23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45 p0.05
0.65 BSC
4.50 p0.10
6.60 p0.10
1.05 p0.10
4.75
(.187)
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.4
0
(.25
2
BSC
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
LT3492
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4.00 p 0.10
(2 SIDES)
2.50 REF
5.00 p 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.1
0
27 28
1
2
BOTTOM VIEW—EXPOSED PAD
3.50 REF
0.75 p 0.05
R = 0.115
TYP
R = 0.05
TYP
PIN 1 NOTCH
R = 0.20 OR 0.3
5
s 45o CHAMFER
0.25 p 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD28) QFN 0506 REV
B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 p0.05
0.25 p0.05
0.50 BSC
2.50 REF
3.50 REF
4.10 p 0.05
5.50 p 0.05
2.65 p 0.05
3.10 p 0.05
4.50 p 0.05
PACKAGE OUTLINE
2.65 p 0.10
3.65 p 0.10
3.65 p 0.05
PACKAGE DESCRIPTION
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)
LT3492
21
3492fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 04/10 Corrected Pin Names for FE Package in Pin Confi guration Section 2

LT3492IFE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LED Lighting Drivers High Current, 60V, 2.1MHz Triple Output LED Driver in 4x5 QFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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