AD7817/AD7818 Data Sheet
Rev. E | Page 10 of 20
TERMINOLOGY
Signal-to-(Noise + Distortion) Ratio
This is the measured ratio of signal-to-(noise + distortion) at
the output of the A/D converter. The signal is the rms amplitude of
the fundamental. Noise is the rms sum of all nonfundamental
signals up to half the sampling frequency (f
S
/2), excluding dc.
The ratio is dependent upon the number of quantization levels
in the digitization process; the more levels, the smaller the
quantization noise. The theoretical signal-to-(noise + distortion)
ratio for an ideal N-bit converter with a sine wave input is given by:
Signal-to-(Noise + Distortion) = (6.02N + 1.76) dB
Thus, for a 10-bit converter, this is 62 dB.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of harmonics to the fundamental.
For the AD7817/AD7818, it is defined as:

1
2
6
2
5
2
4
2
3
2
2
log20
V
VVVVV
dBTHD
where:
V
1
is the rms amplitude of the fundamental.
V
2
, V
3
, V
4
, V
5
, and V
6
are the rms amplitudes of the second
through the sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to f
S
/2 and excluding dc) to the rms value of
the fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum; however,
for devices where the harmonics are buried in the noise floor, it
is a noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities creates distortion products
at sum and difference frequencies of mfa ± nfb, where m, n = 0,
1, 2, 3, etc. Intermodulation terms are those for which neither m
nor n are equal to zero. For example, the second-order terms
include (fa + fb) and (fa − ), while the third-order terms
include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).
The AD7817/AD7818 are tested using the CCIF standard where
two input frequencies near the top end of the input bandwidth
are used. In this case, the second- and third-order terms are of
different significance. The second-order terms are usually
distanced in frequency from the original sine waves, while the
third-order terms are usually at a frequency close to the input
frequencies. As a result, the second- and third-order terms are
specified separately. The calculation of the intermodulation
distortion is as per the THD specification where it is the ratio
of the rms sum of the individual distortion products to the rms
amplitude of the fundamental expressed in dBs.
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of crosstalk
between channels. It is measured by applying a full-scale 20 kHz
sine wave signal to one input channel and determining how much
that signal is attenuated in each of the other channels. The figure
given is the worst case across all four channels.
Relative Accuracy
Relative accuracy or endpoint nonlinearity is the maximum
deviation from a straight line passing through the endpoints
of the ADC transfer function.
Differential Nonlinearity
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Gain Error
This is the deviation of the last code transition (1111 . . . 110) to
(1111 . . . 111) from the ideal, that is, VREF – 1 LSB, after the
offset error has been adjusted out.
Gain Error Match
This is the difference in gain error between any two channels.
Offset Error
This is the deviation of the first code transition (0000 . . . 000) to
(0000 . . . 001) from the ideal, that is, AGND + 1 LSB.
Offset Error Match
This is the difference in offset error between any two channels.
Track-and-Hold Acquisition Time
The track-and-hold acquisition time is the time required for the
output of the track-and-hold amplifier to reach its final value,
within ±1/2 LSB, after the end of conversion (the point at which
the track-and-hold returns to track mode). It also applies to
situations where a change in the selected input channel takes
place or where there is a step input change on the input voltage
applied to the selected V
IN
input of the AD7817 or the AD7818.
It means that the user must wait for the duration of the track-
and-hold acquisition time after the end of conversion or after a
channel change/step input change to V
IN
before starting another
conversion, to ensure that the device operates to specification.
Data Sheet AD7817/AD7818
Rev. E | Page 11 of 20
CONTROL BYTE
The AD7817/AD7818 contain two on-chip registers, the
address register and the overtemperature register. These
registers can be accessed by carrying out an 8-bit serial write
operation to the devices. The 8-bit word or control byte written to
the AD7817/AD7818 is transferred to one of the two on-chip
registers as follows.
Address Register
If the five MSBs of the control byte are logic zero, the three LSBs
of the control byte are transferred to the address register (see
Figure 6). The address register is a 3-bit-wide register used to
select the analog input channel on which to carry out a conversion.
It is also used to select the temperature sensor, which has the 000
address. Table 6 shows the channel selection. The internal reference
selection connects the input of the ADC to a band gap reference.
When this selection is made and a conversion is initiated, the ADC
output must be approximately midscale. After power-up, the
default channel selection is DB2 = DB1 = DB0 = 0 (temperature
sensor).
Table 6. Channel Selection
DB2 DB1 DB0 Channel Selection Device
0 0 0 Temperature sensor All
0 0 1 Channel 1 All
0 1 0 Channel 2 AD7817
0 1 1 Channel 3 AD7817
1 0 0 Channel 4 AD7817
1 1 1 Internal reference (1.23 V) All
Overtemperature Register
If any of the five MSBs of the control byte are logic one, the entire
eight bits of the control byte are transferred to the overtemperature
register (see Figure 6). At the end of a temperature conversion,
a digital comparison is carried out between the 8 MSBs of the
temperature conversion result (10 bits) and the contents of the
overtemperature register (8 bits). If the result of the temperature
conversion is greater than the contents of the overtemperature
register (OTR), the overtemperature indicator (
OTI
) goes logic
low. The resolution of the OTR is 1°C. The lowest temperature
that can be written to the OTR is −95°C and the highest is
+152°C (see Figure 7). However, the usable temperature range of
the temperature sensor is −55°C to +125°C. Figure 7 shows the
OTR and how to set T
ALARM
(the temperature at which the
OTI
goes low).
OTR (Dec) = T
ALARM
(°C) + 103°C
For example, to set T
ALARM
to 50°C, OTR = 50 + 103 = 153 Dec
or 10011001 bin. If the result of a temperature conversion exceeds
50°C,
OTI
goes logic low. The
OTI
logic output is reset high at the
end of a serial read operation or if a new temperature measurement
is lower than T
ALARM
. The default power on T
ALARM
is 50°C.
DB2 DB1 DB0 ADDRESS REGISTER
LSBMSB
DB0 CONTROL BYTEDB7 DB6 DB5 DB4 DB3 DB2 DB1
DB0
OVERTEMPERATURE
REGISTER (OTR)
DB7 DB6 DB5 DB4 DB3 DB2 DB1
IF ANY BIT DB7 TO DB3 ARE LOGIC 0
THEN DB2 TO DB0 ARE WRITTEN TO
THE ADDRESS REGISTER
IF ANY BIT DB7 TO DB3 IS SET TO A
LOGIC 1, THEN THE FULL 8 BITS OF THE
CONTROL WORD ARE WRITTEN TO THE
OVERTEMPERATURE REGISTER
01316-011
Figure 6. Address and Overtemperature Register Selection
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
00001000
11111111
MINIMUM TEMPERATURE = –95°C
MAXIMUM TEMPERATURE = +152°C
MSB LSB
OVERTEMPERATURE REGISTER
OVERTEMPERATURE REGISTER (DEC) = T
ALARM
+ 103°C
T
ALARM
RESOLUTION = 18/LSB
01316-012
Figure 7. The Overtemperature Register (OTR)
AD7817/AD7818 Data Sheet
Rev. E | Page 12 of 20
CIRCUIT INFORMATION
The AD7817/AD7818 are single- and four-channel, 9 µs
conversion time, 10-bit ADCs with an on-chip temperature
sensor, reference, and serial interface logic functions on a single
chip. The ADC section consists of a conventional, successive
approximation converter based around a capacitor DAC. The
AD7817/AD7818 are capable of running on a 2.7 V to 5.5 V power
supply, and they accept an analog input range of 0 V to V
REF
.
The on-chip temperature sensor allows an accurate measurement
of the ambient device temperature to be made. The working
measurement range of the temperature sensor is −55°C to +125°C.
The AD7817/AD7818 require a 2.5 V reference, which can be
provided from their internal reference or from an external
reference source. The on-chip reference is selected by connecting
the REF
IN
pin to analog ground.
CONVERTER DETAILS
Conversion is initiated by pulsing the
CONVST
input. The
conversion clock for the device is internally generated; therefore,
an external clock is not required, except when reading from and
writing to the serial port. The on-chip, track-and-hold goes from
track mode to hold mode, and the conversion sequence is started
on the falling edge of the
CONVST
signal. At this point, the BUSY
signal goes high and low again 9 µs or 27 µs later (depending on
whether an analog input or the temperature sensor is selected)
to indicate the end of the conversion process. A microcontroller
can use this signal to determine when the result of the conversion is
to be read. The track-and-hold acquisition time of the AD7817/
AD7818 is 400 ns.
A temperature measurement is made by selecting the Channel 0
of the on-chip mux and carrying out a conversion on this channel.
A conversion on Channel 0 takes 27 µs to complete. Temperature
measurement is explained in the Temperature Measurement
section.
The on-chip reference is not available, however, REF
IN
can be
overdriven by an external reference source (2.5 V only). The effect
of reference tolerances on temperature measurements is discussed
in the Temperature Measurement Error Due to Reference Error
section.
Tie all unused analog inputs to a voltage within the nominal
analog input range to avoid noise pickup. For minimum power
consumption, tie the unused analog inputs to AGND.
TYPICAL CONNECTION DIAGRAM
Figure 8 shows a typical connection diagram for the AD7817.
The AGND and DGND are connected together at the device for
good noise suppression. The BUSY line is used to interrupt the
microcontroller at the end of the conversion process, and the
serial interface is implemented using three wires (see the AD7817
Serial Interface section for more details). An external 2.5 V
reference can be connected at the REF
IN
pin. If an external reference
is used, connect a 10 µF capacitor between REF
IN
and AGND.
For applications where power consumption is a concern, use the
automatic power-down at the end of a conversion to improve
power performance. See the Power vs. Throughput section.
A
IN1
CONVST
AGND
DGND
REF
IN
V
DD
0.1µF10µF
D
OUT
RD/WR
A
IN2
A
IN3
A
IN4
D
IN
BUSY
OTI
SCLK
3-WIRE
SERIAL
INTERFACE
CS
AD7817
MICROCONVERTER/
MICROPROCESSOR
SUPPLY
2.7V TO 5.5V
OPTIONAL
EXTERNAL
REFERENCE
AD780/
REF-192
0V TO 2.5V
INPUT
10µF
EXTERNAL
REFERENCE
01316-013
Figure 8. Typical Connection Diagram
ANALOG INPUTS
Analog Input
Figure 9 shows an equivalent circuit of the analog input structure of
the AD7817/AD7818. The two diodes, D1 and D2, provide ESD
protection for the analog inputs. Take care to ensure that the
analog input signal never exceeds the supply rails by more than
200 mV. This causes these diodes to become forward-biased
and start conducting current into the substrate. The maximum
current these diodes can conduct without causing irreversible
damage to the device is 20 mA. The C2 capacitor in Figure 9 is
typically about 4 pF and can mostly be attributed to pin
capacitance. The R1 resistor is a lumped component made up
of the on resistance of a multiplexer and a switch. This resistor
is typically about 1 k. The C1 capacitor is the ADC sampling
capacitor and has a capacitance of 3 pF.
A
IN
D1
C1
3pF
V
DD
D2
C2
4pF
V
BALANCE
CONVERT PHASE—SWITCH OPEN
TRACK PHASE—SWITCH CLOSED
R1
1k
01316-014
Figure 9. Equivalent Analog Input Circuit

AD7817SR-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 4CH 10B W/ON-CHIP TEMP SENSOR IC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union