RT8456
www.richtek.com RT8456 Nov. 2011
2
Purpose
The HTOL test is to demonstrate the quality or reliability of device subjects to the
specified conditions over an extended time period.
The ESD tests are used to classify the electrostatic discharge of microcircuits.
The latch-up test is used to check IC latch-up characteristics.
The environment tests are to ensure the process of assembly of this package type that
meets Richtek quality specifications.
Test Items and Conditions
Items Condition Readout Q’ty Rejects Reference
HTOL
T
a
=125℃, 1000 hours 77 0 JESD22-A108
VIN=1.1*VIN_MAX
ESD HBM -- 3/ VOLT 0 JESD22-A114
MM -- 3/ VOLT 0 JESD22-A115
CDM -- 3/ VOLT 0 JESD22-C101
Latch-up I-TEST -- 9 0 JESD78A
V-TEST
Preconditioning MSL-3
Bake 125℃ 24 hours 385 0 JESD22-A113
MSL-3 Soaking 30℃/ 60% RH 192 hours 385 0
Reflow 260 +0/-5℃ 3 cycles 385 0
HTST T
a
=150℃ 1000 hours 77 0 JESD22-A103
THT T
a
=85℃, 85%RH
1000 hours 77 0 JESD22-A101
TCT T
a
=-65℃ ~ 150℃
500 cycles 77 0 JESD22-A104
PCT T
a
=121℃,100%RH,2ATM 168 hours 77 0 JESD22-A102
uHAST T
a
=130℃, 85%RH
96 hours 77 0 JESD22-A118
NOTE: 1. Preconditioning MSL-3 test was done before HTST, THT, TCT, PCT and uHAST tests.
2. All assembly houses are Richtek qualified suppliers.
Summary
The test results can be applied to all of the products including a series of RT8456.
Any questions or inquiries for regarding related products or service of Richtek, you
may contact us through our technical support center.
(http://www.Richtek.com/contact10.1.jsp)
